24-6575 Series

Catalog

CONN IC DIP SOCKET ZIF 24POS TIN

Part	Termination Post Length	Material Flammability Rating	Current Rating	Pitch - Post	Contact Material - Post	Contact Finish - Mating	Housing Material	Features	Contact Finish Thickness - Mating	Grid Rows	Number of Positions or Pins (Grid)	Grid Columns	Contact Finish Thickness - Post	Row Spacing	Type	Contact Material - Mating	Pitch - Mating	Termination	Contact Finish - Post	Mounting Type
Aries Electronics 24-6575-10	0.11 in	UL94 V-0	1 A	0.1 in	Beryllium Copper	Tin	Glass Filled Polyphenylene Sulfide PPS	Closed Frame	200 Ąin	2	24	12	200 µin	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Beryllium Copper	0.1 in	Solder	Tin	Through Hole
Aries Electronics 24-6575-16	0.11 in	UL94 V-0	1 A	0.1 in	Beryllium Copper	Tin	Glass Filled Polyphenylene Sulfide PPS	Closed Frame	200 Ąin	2	24	12	200 µin	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Beryllium Copper	0.1 in	Solder	Tin	Through Hole
Aries Electronics 24-6575-11	0.11 in	UL94 V-0	1 A	0.1 in	Beryllium Copper	Tin	Glass Filled Polyphenylene Sulfide PPS	Closed Frame	200 Ąin	2	24	12	200 µin	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Beryllium Copper	0.1 in	Solder	Tin	Through Hole
Aries Electronics 24-6575-18	0.11 in	UL94 V-0	1 A	0.1 in	Beryllium Copper	Tin	Glass Filled Polyphenylene Sulfide PPS	Closed Frame	200 Ąin	2	24	12	200 µin	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Beryllium Copper	0.1 in	Solder	Tin	Through Hole