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CONN IC DIP SOCKET ZIF 24POS TIN
| Part | Number of Positions or Pins (Grid) | Current Rating (Amps) | Features | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Type | Type | Type | Termination Post Length | Termination Post Length | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination | Pitch - Post | Pitch - Post | Contact Finish - Post | Housing Material | Material Flammability Rating | Contact Material - Post | Contact Material - Mating | Mounting Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 24 | 1 A | Closed Frame | 0.1 in | 2.54 mm | 200 µin | 5.08 µm | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | 0.11 in | 2.78 mm | 5.08 µm | 200 µin | Solder | 2.54 mm | 0.1 in | Tin | Polyphenylene Sulfide (PPS) Glass Filled | UL94 V-0 | Beryllium Copper | Beryllium Copper | Through Hole |
Aries Electronics | 24 | 1 A | Closed Frame | 0.1 in | 2.54 mm | 200 µin | 5.08 µm | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | 0.11 in | 2.78 mm | 5.08 µm | 200 µin | Solder | 2.54 mm | 0.1 in | Tin | Polyphenylene Sulfide (PPS) Glass Filled | UL94 V-0 | Beryllium Copper | Beryllium Copper | Through Hole |
Aries Electronics | 24 | 1 A | Closed Frame | 0.1 in | 2.54 mm | 200 µin | 5.08 µm | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | 0.11 in | 2.78 mm | 5.08 µm | 200 µin | Solder | 2.54 mm | 0.1 in | Tin | Polyphenylene Sulfide (PPS) Glass Filled | UL94 V-0 | Beryllium Copper | Beryllium Copper | Through Hole |
Aries Electronics | 24 | 1 A | Closed Frame | 0.1 in | 2.54 mm | 200 µin | 5.08 µm | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | 0.11 in | 2.78 mm | 5.08 µm | 200 µin | Solder | 2.54 mm | 0.1 in | Tin | Polyphenylene Sulfide (PPS) Glass Filled | UL94 V-0 | Beryllium Copper | Beryllium Copper | Through Hole |