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CONN IC DIP SOCKET 16POS GOLD
| Part | Contact Material - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Type | Type | Type | Pitch - Mating | Pitch - Mating | Number of Positions or Pins (Grid) | Mounting Type | Operating Temperature [Max] | Operating Temperature [Min] | Features | Current Rating (Amps) | Contact Material - Post [custom] | Contact Finish - Mating | Contact Finish - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Material Flammability Rating | Housing Material | Termination Post Length | Termination Post Length | Pitch - Post | Pitch - Post | Termination |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Beryllium Copper | 10 çin | 0.25 çm | 0.3 " | 7.62 mm | DIP | 0.1 in | 2.54 mm | 16 | Through Hole | 105 ░C | -55 °C | Closed Frame Elevated | 3 A | Brass | Gold | Gold | 30 Áin | 0.76 Ám | UL94 V-0 | Glass Filled Nylon 4/6 Polyamide (PA46) | 3.56 mm | 0.14 in | 2.54 mm | 0.1 in | Solder |