30-6823 Series

Catalog

CONN IC DIP SOCKET 30POS GOLD

Part	Features	Contact Finish - Mating	Termination Post Length	Termination Post Length	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Mating	Type	Type	Type	Pitch - Mating	Pitch - Mating	Housing Material	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Contact Finish - Post	Current Rating (Amps)	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Material Flammability Rating	Contact Material - Post	Termination	Pitch - Post	Pitch - Post	Operating Temperature [Max]	Operating Temperature [Min]	Contact Material - Post [custom]
Aries Electronics 30-6823-90	Closed Frame	Gold	0.145 "	3.68 mm	10 çin	0.25 çm	Phosphor Bronze	DIP	0.6 in	15.24 mm	0.1 in	2.54 mm	Polyamide (PA46) Nylon 4/6	30	2	15	Gold	1.5 A	10 çin	0.25 çm	UL94 V-0	Phosphor Bronze	Solder	2.54 mm	0.1 in
Aries Electronics 30-6823-90T	Closed Frame		0.145 "	3.68 mm	200 µin	5.08 µm	Phosphor Bronze	DIP	0.6 in	15.24 mm	0.1 in	2.54 mm	Polyamide (PA46) Nylon 4/6	30	2	15	Tin	1.5 A	200 µin	5.08 µm	UL94 V-0	Phosphor Bronze	Solder	2.54 mm	0.1 in
Aries Electronics 30-6823-90C	Closed Frame	Gold	0.14 in	3.56 mm	200 µin	5.08 µm	Beryllium Copper	DIP	0.6 in	15.24 mm	0.1 in	2.54 mm	Glass Filled Nylon 4/6 Polyamide (PA46)	30	2	15	Tin	3 A	30 Áin	0.76 Ám	UL94 V-0		Solder	2.54 mm	0.1 in	105 ░C	-55 °C	Brass