CONN RCPT 20POS 0.05 GOLD SMD
| Part | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Insulation Height [z] | Insulation Height [z] | Number of Positions | Fastening Type | Contact Material | Insulation Material | Contact Finish - Post | Contact Finish - Mating | Contact Type | Operating Temperature [Min] | Operating Temperature [Max] | Connector Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Features | Number of Positions Loaded | Termination | Material Flammability Rating | Contact Shape | Pitch - Mating | Pitch - Mating | Insulation Color | Mounting Type | Row Spacing - Mating | Row Spacing - Mating | Current Rating (Amps) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 3 µin | 0.076 µm | 0.16 in | 4.06 mm | 20 | Push-Pull | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Gold | Gold | Forked | -55 °C | 125 °C | Receptacle | 30 Áin | 0.76 Ám | Board Guide | All | Solder | UL94 V-0 | Square | 0.05 in | 1.27 mm | Black | Surface Mount | 0.05 in | 1.27 mm | 2.4 A |
Samtec Inc. | 3 µin | 0.076 µm | 0.16 in | 4.06 mm | 20 | Push-Pull | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Gold | Gold | Forked | -55 °C | 125 °C | Receptacle | 30 Áin | 0.76 Ám | Pick and Place | All | Solder | UL94 V-0 | Square | 0.05 in | 1.27 mm | Black | Surface Mount | 0.05 in | 1.27 mm | 2.4 A |
Samtec Inc. | 3 µin | 0.076 µm | 0.16 in | 4.06 mm | 20 | Push-Pull | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Gold | Gold | Forked | -55 °C | 125 °C | Receptacle | 30 Áin | 0.76 Ám | Pick and Place | All | Solder | UL94 V-0 | Square | 0.05 in | 1.27 mm | Black | Surface Mount | 0.05 in | 1.27 mm | 2.4 A |
Samtec Inc. | 3 µin | 0.076 µm | 0.16 in | 4.06 mm | 20 | Push-Pull | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Gold | Gold | Forked | -55 °C | 125 °C | Receptacle | 10 çin | 0.25 çm | Board Guide Pick and Place | All | Solder | UL94 V-0 | Square | 0.05 in | 1.27 mm | Black | Surface Mount | 0.05 in | 1.27 mm | 2.4 A |
Samtec Inc. | 3 µin | 0.076 µm | 0.16 in | 4.06 mm | 20 | Push-Pull | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Gold | Gold | Forked | -55 °C | 125 °C | Receptacle | 30 Áin | 0.76 Ám | All | Solder | UL94 V-0 | Square | 0.05 in | 1.27 mm | Black | Surface Mount | 0.05 in | 1.27 mm | 2.4 A | |
Samtec Inc. | 3 µin | 0.076 µm | 0.16 in | 4.06 mm | 20 | Push-Pull | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Gold | Gold | Forked | -55 °C | 125 °C | Receptacle | 30 Áin | 0.76 Ám | Board Guide Pick and Place | All | Solder | UL94 V-0 | Square | 0.05 in | 1.27 mm | Black | Surface Mount | 0.05 in | 1.27 mm | 2.4 A |
Samtec Inc. | 3 µin | 0.076 µm | 0.16 in | 4.06 mm | 20 | Push-Pull | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Gold | Gold | Forked | -55 °C | 125 °C | Receptacle | 10 çin | 0.25 çm | Board Guide Pick and Place | All | Solder | UL94 V-0 | Square | 0.05 in | 1.27 mm | Black | Surface Mount | 0.05 in | 1.27 mm | 2.4 A |
Samtec Inc. | 3 µin | 0.076 µm | 0.16 in | 4.06 mm | 20 | Push-Pull | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Gold | Gold | Forked | -55 °C | 125 °C | Receptacle | 3 µin | 0.076 µm | All | Solder | UL94 V-0 | Square | 0.05 in | 1.27 mm | Black | Surface Mount | 0.05 in | 1.27 mm | 2.4 A | |
Samtec Inc. | 3 µin | 0.076 µm | 0.16 in | 4.06 mm | 20 | Push-Pull | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Gold | Gold | Forked | -55 °C | 125 °C | Receptacle | 30 Áin | 0.76 Ám | Pick and Place | All | Solder | UL94 V-0 | Square | 0.05 in | 1.27 mm | Black | Surface Mount | 0.05 in | 1.27 mm | 2.4 A |
Samtec Inc. | 3 µin | 0.076 µm | 0.16 in | 4.06 mm | 20 | Push-Pull | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Gold | Gold | Forked | -55 °C | 125 °C | Receptacle | 3 µin | 0.076 µm | Board Guide Pick and Place | All | Solder | UL94 V-0 | Square | 0.05 in | 1.27 mm | Black | Surface Mount | 0.05 in | 1.27 mm | 2.4 A |