40-3575 Series

Catalog

CONN IC DIP SOCKET ZIF 40POS GLD

Part	Termination Post Length	Material Flammability Rating	Current Rating	Contact Finish - Mating	Housing Material	Contact Finish Thickness - Mating	Features	Grid Columns	Number of Positions or Pins (Grid)	Grid Rows	Contact Material - Post	Mounting Type	Contact Finish - Post	Row Spacing	Type	Termination	Contact Material - Mating	Pitch - Post	Pitch - Mating	Contact Finish Thickness - Post
Aries Electronics 40-3575-16	0.11 in	UL94 V-0	1 A	Gold	Glass Filled Polyphenylene Sulfide PPS	10 µin	Closed Frame	20	40	2	Beryllium Copper	Through Hole	Gold	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	Solder	Beryllium Copper	0.1 in	0.1 in	10 µin
Aries Electronics 40-3575-10	0.11 in	UL94 V-0	1 A	Gold	Glass Filled Polyphenylene Sulfide PPS	10 µin	Closed Frame	20	40	2	Beryllium Copper	Through Hole	Gold	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	Solder	Beryllium Copper	0.1 in	0.1 in	10 µin
Aries Electronics 40-3575-11	0.11 in	UL94 V-0	1 A	Gold	Glass Filled Polyphenylene Sulfide PPS	10 µin	Closed Frame	20	40	2	Beryllium Copper	Through Hole	Gold	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	Solder	Beryllium Copper	0.1 in	0.1 in	10 µin