CONN IC DIP SOCKET ZIF 40POS GLD
| Part | Termination Post Length | Termination Post Length | Contact Material - Mating | Type | Type | Type | Contact Finish - Post | Features | Termination | Pitch - Post | Pitch - Post | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Current Rating (Amps) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Pitch - Mating | Pitch - Mating | Material Flammability Rating | Housing Material | Mounting Type | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 0.11 in | 2.78 mm | Beryllium Copper | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | Gold | Closed Frame | Solder | 2.54 mm | 0.1 in | 40 | 20 | 2 | 1 A | Gold | 10 çin | 0.25 çm | 10 çin | 0.25 çm | 0.1 in | 2.54 mm | UL94 V-0 | Polyphenylene Sulfide (PPS) Glass Filled | Through Hole | Beryllium Copper |
Aries Electronics | 0.11 in | 2.78 mm | Beryllium Copper | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | Gold | Closed Frame | Solder | 2.54 mm | 0.1 in | 40 | 20 | 2 | 1 A | Gold | 10 çin | 0.25 çm | 10 çin | 0.25 çm | 0.1 in | 2.54 mm | UL94 V-0 | Polyphenylene Sulfide (PPS) Glass Filled | Through Hole | Beryllium Copper |