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CONN IC DIP SOCKET ZIF 24POS TIN
| Part | Contact Material - Mating | Termination | Number of Positions or Pins (Grid) | Material Flammability Rating | Current Rating (Amps) | Contact Material - Post | Termination Post Length | Termination Post Length | Contact Finish - Post | Pitch - Post | Pitch - Post | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Type | Type | Type | Housing Material | Mounting Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Features | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Beryllium Copper | Solder | 24 | UL94 V-0 | 1 A | Beryllium Copper | 0.11 in | 2.78 mm | Tin | 2.54 mm | 0.1 in | 0.1 in | 2.54 mm | 5.08 µm | 200 µin | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | Polyphenylene Sulfide (PPS) Glass Filled | Through Hole | 200 µin | 5.08 µm | Closed Frame | |
Aries Electronics | Beryllium Copper | Solder | 24 | UL94 V-0 | 1 A | Beryllium Copper | 0.11 in | 2.78 mm | Gold | 2.54 mm | 0.1 in | 0.1 in | 2.54 mm | 0.25 çm | 10 çin | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | Polyphenylene Sulfide (PPS) Glass Filled | Through Hole | 10 çin | 0.25 çm | Closed Frame | Gold |