24-3552 Series

Catalog

CONN IC DIP SOCKET ZIF 24POS TIN

Part	Termination Post Length	Termination Post Length	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Mounting Type	Pitch - Mating	Pitch - Mating	Contact Finish - Post	Number of Positions or Pins (Grid)	Type	Type	Type	Contact Material - Post	Features	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Current Rating (Amps)	Housing Material	Material Flammability Rating	Pitch - Post	Pitch - Post	Termination	Contact Finish - Mating	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 24-3552-10	0.11 in	2.78 mm	200 µin	5.08 µm	Through Hole	0.1 in	2.54 mm	Tin	24	7.62 mm	0.3 in	DIP ZIF (ZIP)	Beryllium Copper	Closed Frame	5.08 µm	200 µin	Beryllium Copper	1 A	Polyphenylene Sulfide (PPS) Glass Filled	UL94 V-0	2.54 mm	0.1 in	Solder
Aries Electronics 24-3552-16	0.11 in	2.78 mm	50 µin	1.27 µm	Through Hole	0.1 in	2.54 mm	Nickel Boron	24	7.62 mm	0.3 in	DIP ZIF (ZIP)	Beryllium Copper	Closed Frame	1.27 µm	50 µin	Beryllium Copper	1 A	Polyphenylene Sulfide (PPS) Glass Filled	UL94 V-0	2.54 mm	0.1 in	Solder	Nickel Boron
Aries Electronics 24-3552-18	0.11 in	2.78 mm	50 µin	1.27 µm	Through Hole	0.1 in	2.54 mm	Nickel Boron	24	7.62 mm	0.3 in	DIP ZIF (ZIP)	Beryllium Nickel	Closed Frame	1.27 µm	50 µin	Beryllium Nickel	1 A	Polyetheretherketone (PEEK) Glass Filled	UL94 V-0	2.54 mm	0.1 in	Solder	Nickel Boron	-55 °C	250 °C
Aries Electronics 24-3552-11	0.11 in	2.78 mm			Through Hole	0.1 in	2.54 mm	Gold	24	7.62 mm	0.3 in	DIP ZIF (ZIP)	Beryllium Copper	Closed Frame			Beryllium Copper	1 A	Polyphenylene Sulfide (PPS) Glass Filled	UL94 V-0	2.54 mm	0.1 in	Solder	Gold