24-3552 Series

Catalog

CONN IC DIP SOCKET ZIF 24POS TIN

Part	Termination Post Length	Material Flammability Rating	Current Rating	Contact Material - Mating	Grid Rows	Number of Positions or Pins (Grid)	Grid Columns	Pitch - Mating	Contact Finish Thickness - Post	Contact Finish - Post	Contact Finish - Mating	Row Spacing	Type	Contact Finish Thickness - Mating	Termination	Pitch - Post	Contact Material - Post	Mounting Type	Features	Housing Material
Aries Electronics 24-3552-10	0.11 in	UL94 V-0	1 A	Beryllium Copper	2	24	12	0.1 in	200 µin	Tin	Tin	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	200 Ąin	Solder	0.1 in	Beryllium Copper	Through Hole	Closed Frame	Glass Filled Polyphenylene Sulfide PPS
Aries Electronics 24-3552-16	0.11 in	UL94 V-0	1 A	Beryllium Copper	2	24	12	0.1 in	50 µin	Nickel Boron	Boron Nickel	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	50 µin	Solder	0.1 in	Beryllium Copper	Through Hole	Closed Frame	Glass Filled Polyphenylene Sulfide PPS
Aries Electronics 24-3552-11	0.11 in	UL94 V-0	1 A	Beryllium Copper	2	24	12	0.1 in		Gold	Gold	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)		Solder	0.1 in	Beryllium Copper	Through Hole	Closed Frame	Glass Filled Polyphenylene Sulfide PPS