CONN HEADER SMD 180POS 0.8MM
| Part | Pitch - Mating | Pitch - Mating | Shrouding | Connector Type | Features | Contact Material | Fastening Type | Operating Temperature [Min] | Operating Temperature [Max] | Termination | Insulation Material | Mounting Type | Contact Shape | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Current Rating (Amps) | Contact Length - Mating [x] | Contact Length - Mating [x] | Insulation Color | Number of Rows | Material Flammability Rating | Number of Positions Loaded | Row Spacing - Mating | Row Spacing - Mating | Insulation Height [z] | Insulation Height [z] | Number of Positions | Contact Type | Contact Finish - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 0.031 in | 0.8 mm | Unshrouded | Header | Board Guide End Shrouds | Phosphor Bronze | Push-Pull | -55 °C | 125 °C | Solder | Liquid Crystal Polymer (LCP) | Surface Mount | Square | 10 çin | 0.25 çm | 2.7 A | 1.9 mm | 0.075 in | Black | 2 | UL94 V-0 | All | 1.2 mm | 0.047 in | 0.055 in | 1.4 mm | 180 | Male Pin | Gold | Gold | ||
Samtec Inc. | 0.031 in | 0.8 mm | Unshrouded | Header | Phosphor Bronze | Push-Pull | -55 °C | 125 °C | Solder | Liquid Crystal Polymer (LCP) | Surface Mount | Square | 10 çin | 0.25 çm | 2.7 A | 1.9 mm | 0.075 in | Black | 2 | UL94 V-0 | All | 1.2 mm | 0.047 in | 0.055 in | 1.4 mm | 180 | Male Pin | Gold | Gold | 3 µin | 0.076 µm |