MC33PF8200 Series

Catalog

POWER MANAGEMENT IC, I.MX8, PRE-PROG, 7 BUCK, 4 LDO, ASIL-B, AUTO, QFN 56/ TRAY ROHS COMPLIANT: YES

Part	Package Width	Package Name	Package Length	Package / Case	Applications	Mounting Type	Operating Temperature (Max)	Operating Temperature (Min)	Voltage - Supply (Maximum)	Voltage - Supply (Minimum)
NXP USA Inc. MC33PF8200ESES	8 mm	56-HVQFN	8 mm	56-VFQFN Exposed Pad	High Performance i.MX 8 S32x Processor Based	Surface Mount Wettable Flank	105 °C	-40 °C	5.5 V	2.7 V
NXP USA Inc. MC33PF8200DAES	8 mm	56-HVQFN	8 mm	56-VFQFN Exposed Pad	High Performance i.MX 8 S32x Processor Based	Surface Mount Wettable Flank	105 °C	-40 °C	5.5 V	2.5 V
NXP USA Inc. MC33PF8200A0ESR2	8 mm	56-HVQFN	8 mm	56-VFQFN Exposed Pad	High Performance i.MX 8 S32x Processor Based	Surface Mount Wettable Flank	105 °C	-40 °C	5.5 V	2.5 V
NXP USA Inc. MC33PF8200DBES	8 mm	56-HVQFN	8 mm	56-VFQFN Exposed Pad	High Performance i.MX 8 S32x Processor Based	Surface Mount Wettable Flank	105 °C	-40 °C	5.5 V	2.5 V
NXP USA Inc. MC33PF8200DEESR2	8 mm	56-HVQFN	8 mm	56-VFQFN Exposed Pad	High Performance i.MX 8 S32x Processor Based	Surface Mount Wettable Flank	105 °C	-40 °C	5.5 V	2.5 V
NXP USA Inc. MC33PF8200D2ESR2	8 mm	56-HVQFN	8 mm	56-VFQFN Exposed Pad	High Performance i.MX 8 S32x Processor Based	Surface Mount Wettable Flank	105 °C	-40 °C	5.5 V	2.5 V
NXP USA Inc. MC33PF8200CXESR2	8 mm	56-HVQFN	8 mm	56-VFQFN Exposed Pad	High Performance i.MX 8 S32x Processor Based	Surface Mount Wettable Flank	105 °C	-40 °C	5.5 V	2.5 V
NXP USA Inc. MC33PF8200DFESR2	8 mm	56-HVQFN	8 mm	56-VFQFN Exposed Pad	High Performance i.MX 8 S32x Processor Based	Surface Mount Wettable Flank	105 °C	-40 °C	5.5 V	2.5 V
NXP USA Inc. MC33PF8200EMES	8 mm	56-HVQFN	8 mm	56-VFQFN Exposed Pad	High Performance i.MX 8 S32x Processor Based	Surface Mount Wettable Flank	105 °C	-40 °C	5.5 V	2.5 V
NXP USA Inc. MC33PF8200DNESR2	8 mm	56-HVQFN	8 mm	56-VFQFN Exposed Pad	High Performance i.MX 8 S32x Processor Based	Surface Mount Wettable Flank	105 °C	-40 °C	5.5 V	2.5 V