30-8125 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET 30POS GOLD
| Part | Material Flammability Rating | Current Rating | Termination Post Length | Grid Rows | Number of Positions or Pins (Grid) | Grid Columns | Termination | Pitch - Post | Operating Temperature (Min) | Operating Temperature (Max) | Contact Material - Mating | Contact Finish Thickness - Mating | Contact Material - Post | Pitch - Mating | Row Spacing | Type | Features | Contact Finish - Post | Mounting Type | Contact Finish Thickness - Post | Contact Finish - Mating | Housing Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | UL94 V-0 | 3 A | 0.14 in | 2 | 30 | 15 | Solder | 0.1 in | -55 °C | 105 °C | Beryllium Copper | 30 µin | Brass | 0.1 in | 0.6 in | 0.6" (15.24mm) Row Spacing DIP | Closed Frame Elevated | Gold | Through Hole | 10 µin | Gold | Glass Filled Nylon 4/6 PA46 Polyamide |