Beta
⌘K
CONN SOCKET PGA ZIF GOLD
| Part | Termination | Contact Finish - Mating | Pitch - Post | Pitch - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Operating Temperature [Max] | Operating Temperature [Min] | Pitch - Mating | Pitch - Mating | Termination Post Length | Termination Post Length | Contact Finish - Post | Type | Mounting Type | Contact Material - Post | Features | Current Rating (Amps) | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Material Flammability Rating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Solder | Gold | 2.54 mm | 0.1 in | 30 Áin | 0.76 Ám | Beryllium Copper | 125 °C | -65 ░C | 0.1 in | 2.54 mm | 3.18 mm | 0.125 in | Tin | PGA ZIF (ZIP) | Through Hole | Beryllium Copper | Closed Frame | 1 A | 200 µin | 5.08 µm | UL94 V-0 |