SS-103 Series
Manufacturer: Samtec Inc.
Beta
⌘K
SOCKET STRIPS
| Part | Contact Material | Contact Shape | Insulation Material | Operating Temperature (Max) | Operating Temperature (Min) | Mounting Type | Number of Positions Loaded | Pitch - Mating | Contact Finish - Mating | Contact Length - Post | Style | Termination | Number of Rows | Contact Type | Fastening Type | Contact Finish - Post | Connector Type | Insulation Height | Number of Positions | Insulation Color | Features | Contact Finish Thickness - Mating | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Samtec Inc. | Beryllium Copper | Circular | Glass Filled Polybutylene Terephthalate (PBT) | 125 °C | -55 °C | Through Hole | All | 0.1 in | Tin | 0.36 in | Board | Solder | 1 | Female Socket | Push-Pull | Tin | Receptacle | 0.1 in | 3 | Black | |||
Samtec Inc. | Beryllium Copper | Circular | Glass Filled Polybutylene Terephthalate (PBT) | 125 °C | -55 °C | Through Hole | All | 0.1 in | Gold | 0.125 in | Board | Solder | 1 | Female Socket | Push-Pull | Tin | Receptacle | 0.1 in | 3 | Black | Board Lock | 30 µin | |
Samtec Inc. | Beryllium Copper | Circular | Glass Filled Polybutylene Terephthalate (PBT) | 125 °C | -55 °C | Through Hole | All | 0.1 in | Gold | 0.125 in | Board | Solder | 1 | Female Socket | Push-Pull | Tin | Receptacle | 0.1 in | 3 | Black | 10 µin | ||
 Samtec Inc. | Beryllium Copper | Circular | Glass Filled Polybutylene Terephthalate (PBT) | 125 °C | -55 °C | Through Hole | All | 0.1 in | Gold | 0.125 in | Board | Solder | 1 | Female Socket | Push-Pull | Gold | Receptacle | 0.1 in | 3 | Black | 30 µin | 10 µin | |
Samtec Inc. | Beryllium Copper | Circular | Glass Filled Polybutylene Terephthalate (PBT) | 125 °C | -55 °C | Through Hole | All | 0.1 in | Gold | 0.36 in | Board | Solder | 1 | Female Socket | Push-Pull | Gold | Receptacle | 0.1 in | 3 | Black | 30 µin | 10 µin | |
Samtec Inc. | Beryllium Copper | Circular | Glass Filled Polybutylene Terephthalate (PBT) | 125 °C | -55 °C | Through Hole | All | 0.1 in | Tin | 0.26 in | Board | Solder | 1 | Female Socket | Push-Pull | Tin | Receptacle | 0.1 in | 3 | Black | |||
Samtec Inc. | Beryllium Copper | Circular | Glass Filled Polybutylene Terephthalate (PBT) | 125 °C | -55 °C | Through Hole | All | 0.1 in | Gold | 0.51 in | Board | Solder | 1 | Female Socket | Push-Pull | Tin | Receptacle | 0.1 in | 3 | Black | 30 µin | ||
Samtec Inc. | Beryllium Copper | Circular | Glass Filled Polybutylene Terephthalate (PBT) | 125 °C | -55 °C | Through Hole | All | 0.1 in | Gold | 0.26 in | Board | Solder | 1 | Female Socket | Push-Pull | Gold | Receptacle | 0.1 in | 3 | Black | 30 µin | 10 µin | |
Samtec Inc. | Beryllium Copper | Circular | Glass Filled Polybutylene Terephthalate (PBT) | 125 °C | -55 °C | Through Hole | All | 0.1 in | Gold | Board | Solder | 1 | Female Socket | Push-Pull | Gold | Receptacle | 0.1 in | 3 | Black | 30 µin | 10 µin | ||
Samtec Inc. | Beryllium Copper | Circular | Glass Filled Polybutylene Terephthalate (PBT) | 125 °C | -55 °C | Through Hole | All | 0.1 in | Gold | 0.125 in | Board | Solder | 1 | Female Socket | Push-Pull | Tin | Receptacle | 0.1 in | 3 | Black | 10 µin |