32-3575 Series

Catalog

CONN IC DIP SOCKET ZIF 32POS

Part	Contact Material - Mating	Termination Post Length	Termination Post Length	Pitch - Mating	Pitch - Mating	Mounting Type	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Housing Material	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Mating	Current Rating (Amps)	Contact Material - Post	Type	Type	Type	Features	Pitch - Post	Pitch - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Material Flammability Rating	Termination	Contact Finish - Post
Aries Electronics 32-3575-10	Beryllium Nickel	0.11 in	2.78 mm	0.1 in	2.54 mm	Through Hole	2 x 16	32	Polyphenylene Sulfide (PPS) Glass Filled	1.27 µm	50 µin	Nickel Boron	1 A	Beryllium Nickel	7.62 mm	0.3 in	DIP ZIF (ZIP)	Closed Frame	2.54 mm	0.1 in	1.27 µm	50 µin	UL94 V-0	Solder	Nickel Boron
Aries Electronics 32-3575-18	Beryllium Nickel	0.11 in	2.78 mm	0.1 in	2.54 mm	Through Hole	2 x 16	32	Polyphenylene Sulfide (PPS) Glass Filled	1.27 µm	50 µin	Nickel Boron	1 A	Beryllium Nickel	7.62 mm	0.3 in	DIP ZIF (ZIP)	Closed Frame	2.54 mm	0.1 in	1.27 µm	50 µin	UL94 V-0	Solder	Nickel Boron
Aries Electronics 32-3575-16	Beryllium Nickel	0.11 in	2.78 mm	0.1 in	2.54 mm	Through Hole	2 x 16	32	Polyphenylene Sulfide (PPS) Glass Filled	1.27 µm	50 µin	Nickel Boron	1 A	Beryllium Nickel	7.62 mm	0.3 in	DIP ZIF (ZIP)	Closed Frame	2.54 mm	0.1 in	1.27 µm	50 µin	UL94 V-0	Solder	Nickel Boron