32-3575 Series

Catalog

CONN IC DIP SOCKET ZIF 32POS

Part	Current Rating	Termination Post Length	Material Flammability Rating	Features	Contact Material - Post	Grid Columns	Number of Positions or Pins (Grid)	Grid Rows	Mounting Type	Contact Finish Thickness - Mating	Contact Material - Mating	Contact Finish - Post	Housing Material	Contact Finish - Mating	Termination	Pitch - Mating	Row Spacing	Type	Contact Finish Thickness - Post	Pitch - Post
Aries Electronics 32-3575-10	1 A	0.11 in	UL94 V-0	Closed Frame	Beryllium Nickel	16	32	2	Through Hole	50 µin	Beryllium Nickel	Nickel Boron	Glass Filled Polyphenylene Sulfide PPS	Boron Nickel	Solder	0.1 in	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	50 µin	0.1 in
Aries Electronics 32-3575-18	1 A	0.11 in	UL94 V-0	Closed Frame	Beryllium Nickel	16	32	2	Through Hole	50 µin	Beryllium Nickel	Nickel Boron	Glass Filled Polyphenylene Sulfide PPS	Boron Nickel	Solder	0.1 in	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	50 µin	0.1 in
Aries Electronics 32-3575-16	1 A	0.11 in	UL94 V-0	Closed Frame	Beryllium Nickel	16	32	2	Through Hole	50 µin	Beryllium Nickel	Nickel Boron	Glass Filled Polyphenylene Sulfide PPS	Boron Nickel	Solder	0.1 in	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	50 µin	0.1 in
Aries Electronics 32-3575-11	1 A	0.11 in	UL94 V-0	Closed Frame	Beryllium Nickel	16	32	2	Through Hole	50 µin	Beryllium Nickel	Nickel Boron	Glass Filled Polyphenylene Sulfide PPS	Boron Nickel	Solder	0.1 in	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	50 µin	0.1 in