24-7068 Series

Catalog

SOLDER NO-CLEAN .050" 16AWG 1LB

Part	Weight	Shelf Life Start	Storage/Refrigeration Temperature (Minimum)	Storage/Refrigeration Temperature (Maximum)	Type	Ag Composition	Composition Elements	Composition Formula	Cu Composition	Sn Composition	Form Weight	Form	Diameter	Shelf Life	Melting Point (Max)	Melting Point (Min)	Process	Wire Gauge	Flux Type
Kester Solder 24-7068-7606	1 lbs	Date of Manufacture	50 °F	104 °F	Wire Solder	3 %	Ag Cu Sn	Sn96.5Ag3Cu0.5	0.5 %	96.5 %	1 lb	Spool	0.05 in	36 Months	424 °F	423 °F	Lead Free	16 AWG 18 SWG
Kester Solder 24-7068-1407			50 °F	104 °F	Wire Solder	3 %	Ag Cu Sn	Sn96.5Ag3Cu0.5	0.5 %	96.5 %	1 lb	Spool	0.015 in		424 °F	423 °F	Lead Free	27 AWG 28 SWG	Rosin Activated (RA)
Kester Solder 24-7068-7618		Date of Manufacture	50 °F	104 °F	Wire Solder	3 %	Ag Cu Sn	Sn96.5Ag3Cu0.5	0.5 %	96.5 %	1 lb	Spool	0.031 in	36 Months	424 °F	423 °F	Lead Free	20 AWG 22 SWG
Kester Solder 24-7068-6403	1 lbs	Date of Manufacture	50 °F	104 °F	Wire Solder	3 %	Ag Cu Sn	Sn96.5Ag3Cu0.5	0.5 %	96.5 %	1 lb	Spool	0.031 in	36 Months	424 °F	423 °F	Lead Free	20 AWG 22 SWG	Water Soluble
Kester Solder 24-7068-1401	1 lbs		50 °F	104 °F	Wire Solder	3 %	Ag Cu Sn	Sn96.5Ag3Cu0.5	0.5 %	96.5 %	1 lb	Spool	0.02 in		424 °F	423 °F	Lead Free	24 AWG 25 SWG	Rosin Activated (RA)
Kester Solder 24-7068-1405			50 °F	104 °F	Wire Solder	3 %	Ag Cu Sn	Sn96.5Ag3Cu0.5	0.5 %	96.5 %	1 lb	Spool	0.04 in		424 °F	423 °F	Lead Free	18 AWG 19 SWG	Rosin Activated (RA)
Kester Solder 24-7068-7608		Date of Manufacture	50 °F	104 °F	Wire Solder	3 %	Ag Cu Sn	Sn96.5Ag3Cu0.5	0.5 %	96.5 %	1 lb	Spool	0.015 in	36 Months	424 °F	423 °F	Lead Free	27 AWG 28 SWG
Kester Solder 24-7068-8846			50 °F	104 °F	Wire Solder	3 %	Ag Cu Sn	Sn96.5Ag3Cu0.5	0.5 %	96.5 %	1 lb	Spool	0.04 in		424 °F	423 °F	Lead Free	18 AWG 19 SWG
Kester Solder 24-7068-6409	1 lbs	Date of Manufacture	50 °F	104 °F	Wire Solder	3 %	Ag Cu Sn	Sn96.5Ag3Cu0.5	0.5 %	96.5 %	1 lb	Spool	0.05 in	36 Months	424 °F	423 °F	Lead Free	16 AWG 18 SWG	Water Soluble
Kester Solder 24-7068-0039			50 °F	104 °F	Wire Solder	3 %	Ag Cu Sn	Sn96.5Ag3Cu0.5	0.5 %	96.5 %	1 lb	Spool	0.04 in		424 °F	423 °F	Lead Free	18 AWG 19 SWG	Rosin Activated (RA)