36-3575 Series

Catalog

CONN IC DIP SOCKET ZIF 36POS TIN

Part	Contact Finish - Post	Number of Positions or Pins (Grid)	Contact Material - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Termination	Features	Material Flammability Rating	Current Rating (Amps)	Housing Material	Pitch - Mating	Pitch - Mating	Termination Post Length	Termination Post Length	Type	Type	Type	Mounting Type	Pitch - Post	Pitch - Post	Contact Material - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating
Aries Electronics 36-3575-18	Tin	36	Beryllium Copper	200 µin	5.08 µm	Solder	Closed Frame	UL94 V-0	1 A	Polyphenylene Sulfide (PPS) Glass Filled	0.1 in	2.54 mm	0.11 in	2.78 mm	7.62 mm	0.3 in	DIP ZIF (ZIP)	Through Hole	2.54 mm	0.1 in	Beryllium Copper	5.08 µm	200 µin
Aries Electronics 36-3575-11	Tin	36	Beryllium Copper	200 µin	5.08 µm	Solder	Closed Frame	UL94 V-0	1 A	Polyphenylene Sulfide (PPS) Glass Filled	0.1 in	2.54 mm	0.11 in	2.78 mm	7.62 mm	0.3 in	DIP ZIF (ZIP)	Through Hole	2.54 mm	0.1 in	Beryllium Copper	5.08 µm	200 µin
Aries Electronics 36-3575-16	Tin	36	Beryllium Copper	200 µin	5.08 µm	Solder	Closed Frame	UL94 V-0	1 A	Polyphenylene Sulfide (PPS) Glass Filled	0.1 in	2.54 mm	0.11 in	2.78 mm	7.62 mm	0.3 in	DIP ZIF (ZIP)	Through Hole	2.54 mm	0.1 in	Beryllium Copper	5.08 µm	200 µin
Aries Electronics 36-3575-10	Tin	36	Beryllium Copper	200 µin	5.08 µm	Solder	Closed Frame	UL94 V-0	1 A	Polyphenylene Sulfide (PPS) Glass Filled	0.1 in	2.54 mm	0.11 in	2.78 mm	7.62 mm	0.3 in	DIP ZIF (ZIP)	Through Hole	2.54 mm	0.1 in	Beryllium Copper	5.08 µm	200 µin