MOLC-115 Series
Manufacturer: Samtec Inc.
Beta
⌘K
CONN HEADER SMD 60POS 1.27MM
| Part | Contact Material | Style | Number of Positions Loaded | Mounting Type | Pitch - Mating | Number of Rows | Current Rating (Per Contact) | Contact Finish - Mating | Insulation Color | Material Flammability Rating | Insulation Material | Number of Positions | Termination | Contact Shape | Contact Finish Thickness - Mating | Contact Finish - Post | Features | Row Spacing - Mating | Operating Temperature (Max) | Operating Temperature (Min) | Contact Length - Mating | Contact Type | Shrouding | Fastening Type | Insulation Height | Connector Type | Contact Length - Post | Mated Stacking Height |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Samtec Inc. | Phosphor Bronze | Board | All | Surface Mount | 0.05 in | 4 | 2.6 A | Gold | Black | UL94 V-0 | Liquid Crystal Polymer (LCP) | 60 | Solder | Square | 30 µin | Tin | Pick and Place | 0.05 in | 125 °C | -55 °C | 0.13 in | Male Pin | Shrouded - 4 Wall | Push-Pull | 0.215 in | Header | ||
Samtec Inc. | Phosphor Bronze | Board | All | Through Hole | 0.05 in | 4 | 2.6 A | Gold | Black | UL94 V-0 | Liquid Crystal Polymer (LCP) | 60 | Solder | Square | 30 µin | Tin | 0.05 in | 125 °C | -55 °C | 0.133 in | Male Pin | Shrouded - 4 Wall | Push-Pull | 0.22 in | Header | 0.075 in | 5.97 mm | |
Samtec Inc. | Phosphor Bronze | Board | All | Surface Mount | 0.05 in | 4 | 2.6 A | Gold | Black | UL94 V-0 | Liquid Crystal Polymer (LCP) | 60 | Solder | Square | 10 µin | Tin | 0.05 in | 125 °C | -55 °C | 0.13 in | Male Pin | Shrouded - 4 Wall | Push-Pull | 0.215 in | Header | |||
Samtec Inc. | Phosphor Bronze | Board | All | Through Hole | 0.05 in | 4 | 2.6 A | Gold | Black | UL94 V-0 | Liquid Crystal Polymer (LCP) | 60 | Solder | Square | 30 µin | Tin | Board Lock | 0.05 in | 125 °C | -55 °C | 0.133 in | Male Pin | Shrouded - 4 Wall | Push-Pull | 0.22 in | Header | 0.075 in | 5.97 mm |
Samtec Inc. | Phosphor Bronze | Board | All | Through Hole | 0.05 in | 4 | 2.6 A | Gold | Black | UL94 V-0 | Liquid Crystal Polymer (LCP) | 60 | Solder | Square | 10 µin | Tin | Board Lock | 0.05 in | 125 °C | -55 °C | 0.133 in | Male Pin | Shrouded - 4 Wall | Push-Pull | 0.22 in | Header | 0.075 in | 5.97 mm |
Samtec Inc. | Phosphor Bronze | Board | All | Surface Mount | 0.05 in | 4 | 2.6 A | Gold | Black | UL94 V-0 | Liquid Crystal Polymer (LCP) | 60 | Solder | Square | 30 µin | Tin | 0.05 in | 125 °C | -55 °C | 0.13 in | Male Pin | Shrouded - 4 Wall | Push-Pull | 0.215 in | Header | |||
Samtec Inc. | Phosphor Bronze | Board | All | Through Hole | 0.05 in | 4 | 2.6 A | Gold | Black | UL94 V-0 | Liquid Crystal Polymer (LCP) | 60 | Solder | Square | 30 µin | Tin | Board Lock | 0.05 in | 125 °C | -55 °C | 0.144 in | Male Pin | Shrouded - 4 Wall | Push-Pull | 0.435 in | Header | 0.075 in | 11.43 mm |
Samtec Inc. | Phosphor Bronze | Board | All | Through Hole | 0.05 in | 4 | 2.6 A | Gold | Black | UL94 V-0 | Liquid Crystal Polymer (LCP) | 60 | Solder | Square | 10 µin | Tin | 0.05 in | 125 °C | -55 °C | 0.133 in | Male Pin | Shrouded - 4 Wall | Push-Pull | 0.22 in | Header | 0.075 in | 5.97 mm |