Beta
⌘K
CONN SOCKET PGA ZIF GOLD
| Part | Contact Finish - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Pitch - Post | Pitch - Post | Contact Material - Post | Features | Material Flammability Rating | Pitch - Mating | Pitch - Mating | Contact Material - Mating | Termination Post Length | Termination Post Length | Type | Termination | Current Rating (Amps) | Operating Temperature [Max] | Operating Temperature [Min] | Mounting Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Gold | 200 µin | 5.08 µm | 30 Áin | 0.76 Ám | Tin | 2.54 mm | 0.1 in | Beryllium Copper | Closed Frame | UL94 V-0 | 0.1 in | 2.54 mm | Beryllium Copper | 3.18 mm | 0.125 in | PGA ZIF (ZIP) | Solder | 1 A | 125 °C | -65 ░C | Through Hole |