T2M-107 Series

Catalog

CONN HEADER SMD 14POS 2MM

Part	Style	Contact Material	Row Spacing - Mating	Row Spacing - Mating	Number of Positions	Number of Rows	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Mating [x]	Pitch - Mating [x]	Number of Positions Loaded	Mounting Type	Termination	Insulation Height	Insulation Height	Connector Type	Contact Type	Contact Finish - Post	Insulation Color	Current Rating (Amps)	Shrouding	Insulation Material	Fastening Type	Contact Finish - Mating	Contact Shape	Features	Overall Contact Length	Overall Contact Length	Contact Length - Post	Contact Length - Post	Insulation Height [z]	Insulation Height [z]
Samtec Inc. T2M-107-01-L-D-SM	Board to Board Cable	Phosphor Bronze	0.079 in	2 mm	14	2	-55 °C	125 °C	10 çin	0.25 çm	0.079 in	2 mm	All	Surface Mount	Solder	5.8 mm	0.228 in	Header	Male Pin	Tin	Black	3.8 A	Shrouded - 4 Wall	Liquid Crystal Polymer (LCP)	Push-Pull	Gold	Square
Samtec Inc. T2M-107-01-L-D-SM-K-TR	Board to Board Cable	Phosphor Bronze	0.079 in	2 mm	14	2	-55 °C	125 °C	10 çin	0.25 çm	0.079 in	2 mm	All	Surface Mount	Solder	5.8 mm	0.228 in	Header	Male Pin	Tin	Black	3.8 A	Shrouded - 4 Wall	Liquid Crystal Polymer (LCP)	Push-Pull	Gold	Square	Pick and Place
Samtec Inc. T2M-107-01-L-D-SM-K	Board to Board Cable	Phosphor Bronze	0.079 in	2 mm	14	2	-55 °C	125 °C	10 çin	0.25 çm	0.079 in	2 mm	All	Surface Mount	Solder	5.8 mm	0.228 in	Header	Male Pin	Tin	Black	3.8 A	Shrouded - 4 Wall	Liquid Crystal Polymer (LCP)	Push-Pull	Gold	Square	Pick and Place
Samtec Inc. T2M-107-01-L-D-SM-TR	Board to Board Cable	Phosphor Bronze	0.079 in	2 mm	14	2	-55 °C	125 °C	10 çin	0.25 çm	0.079 in	2 mm	All	Surface Mount	Solder	5.8 mm	0.228 in	Header	Male Pin	Tin	Black	3.8 A	Shrouded - 4 Wall	Liquid Crystal Polymer (LCP)	Push-Pull	Gold	Square
Samtec Inc. T2M-107-01-S-D-SM-WT	Board to Board Cable	Phosphor Bronze	0.079 in	2 mm	14	2	-55 °C	125 °C	30 Áin	0.76 Ám	0.079 in	2 mm	All	Surface Mount	Solder	5.8 mm	0.228 in	Header	Male Pin	Tin	Black	3.8 A	Shrouded - 4 Wall	Liquid Crystal Polymer (LCP)	Push-Pull	Gold	Square	Solder Retention
Samtec Inc. T2M-107-01-S-D-SM	Board to Board Cable	Phosphor Bronze	0.079 in	2 mm	14	2	-55 °C	125 °C	30 Áin	0.76 Ám	0.079 in	2 mm	All	Surface Mount	Solder	5.8 mm	0.228 in	Header	Male Pin	Tin	Black	3.8 A	Shrouded - 4 Wall	Liquid Crystal Polymer (LCP)	Push-Pull	Gold	Square
Samtec Inc. T2M-107-01-S-D-TH-WT	Board to Board Cable	Phosphor Bronze	0.079 in	2 mm	14	2	-55 °C	125 °C	30 Áin	0.76 Ám	0.079 in	2 mm	All	Through Hole	Solder	5.8 mm	0.228 in	Header	Male Pin	Tin	Black	3.8 A	Shrouded - 4 Wall	Liquid Crystal Polymer (LCP)	Push-Pull	Gold	Square	Solder Retention	0.302 in	7.67 mm	0.117 in	2.97 mm
Samtec Inc. T2M-107-01-L-D-TH-DS	Board to Board Cable	Phosphor Bronze	0.079 in	2 mm	14	2	-55 °C	125 °C	10 çin	0.25 çm	0.079 in	2 mm	All	Through Hole	Solder	5.8 mm	0.228 in	Header	Male Pin	Tin	Black	3.8 A	Shrouded - 4 Wall	Liquid Crystal Polymer (LCP)	Push-Pull	Gold	Square	Mating Flange	0.302 in	7.67 mm	0.117 in	2.97 mm
Samtec Inc. T2M-107-01-S-D-RA-WT	Board to Board Cable	Phosphor Bronze	0.079 in	2 mm	14	2	-55 °C	125 °C	30 Áin	0.76 Ám	0.079 in	2 mm	All	Through Hole Right Angle	Solder			Header	Male Pin	Tin	Black	3.8 A	Shrouded - 4 Wall	Liquid Crystal Polymer (LCP)	Push-Pull	Gold	Square	Solder Retention			0.09 "	2.29 mm	7.44 mm	0.293 in
Samtec Inc. T2M-107-01-L-D-RA	Board to Board Cable	Phosphor Bronze	0.079 in	2 mm	14	2	-55 °C	125 °C	10 çin	0.25 çm	0.079 in	2 mm	All	Through Hole Right Angle	Solder			Header	Male Pin	Tin	Black	3.8 A	Shrouded - 4 Wall	Liquid Crystal Polymer (LCP)	Push-Pull	Gold	Square				0.09 "	2.29 mm	7.44 mm	0.293 in