MPC8309 Series
Manufacturer: NXP USA Inc.
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IC MPU MPC83XX 266MHZ 489BGA
| Part | Core Processor | Ethernet Ports | Ethernet Speed Options | USB 2.0 Count | USB | Package / Case | Additional Interfaces | Operating Temperature (Max) | Operating Temperature (Min) | Voltage - I/O (Option 2) | Voltage - I/O (Option 1) | Co-Processors/DSP | Speed | RAM Controllers | Mounting Type | Graphics Acceleration | Bus Width | Number of Cores | Package Name | Package Length | Package Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 NXP USA Inc. | PowerPC e300c3 | 3 | 100Mbps 10Mbps | 1 count | USB 2.0 | 489-LFBGA | CAN DUART I2C MMC PCI SD SPI TDM | 105 °C | 0 °C | 3.3 V | 1.8 V | Communications QUICC Engine | 266 MHz | DDR2 | Surface Mount | No | 32 Bit | 1 Core | 489-PBGA | 19 mm | 19 mm |
 NXP USA Inc. | PowerPC e300c3 | 3 | 100Mbps 10Mbps | 1 count | USB 2.0 | 489-LFBGA | CAN DUART I2C MMC PCI SD SPI TDM | 105 °C | 0 °C | 3.3 V | 1.8 V | Communications QUICC Engine | 400 MHz | DDR2 | Surface Mount | No | 32 Bit | 1 Core | 489-PBGA | 19 mm | 19 mm |
NXP USA Inc. | PowerPC e300c3 | 3 | 100Mbps 10Mbps | 1 count | USB 2.0 | 489-LFBGA | CAN DUART I2C MMC PCI SD SPI TDM | 105 °C | 0 °C | 3.3 V | 1.8 V | Communications QUICC Engine | 400 MHz | DDR2 | Surface Mount | No | 32 Bit | 1 Core | 489-FBGA | 19 mm | 19 mm |
NXP USA Inc. | PowerPC e300c3 | 3 | 100Mbps 10Mbps | 1 count | USB 2.0 | 489-LFBGA | CAN DUART I2C MMC PCI SD SPI TDM | 105 °C | -40 °C | 3.3 V | 1.8 V | Communications QUICC Engine | 417 MHz | DDR2 | Surface Mount | No | 32 Bit | 1 Core | 489-PBGA | 19 mm | 19 mm |