T2M-118 Series

Catalog

HIGH RELIABILITY TIGER EYE DISCR

Part	Insulation Material	Termination	Contact Finish - Mating	Current Rating (Amps)	Fastening Type	Number of Positions Loaded	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Connector Type	Style	Features	Contact Finish - Post	Mounting Type	Insulation Height	Insulation Height	Pitch - Mating [x]	Pitch - Mating [x]	Shrouding	Insulation Color	Row Spacing - Mating	Row Spacing - Mating	Contact Material	Number of Positions	Contact Shape	Contact Type	Number of Rows	Insulation Height [z]	Insulation Height [z]	Contact Length - Post	Contact Length - Post
Samtec Inc. T2M-118-01-L-D-SM-WT	Liquid Crystal Polymer (LCP)	Solder	Gold	3.8 A	Push-Pull	All	10 çin	0.25 çm	-55 °C	125 °C	Header	Board to Board Cable	Solder Retention	Tin	Surface Mount	5.8 mm	0.228 in	0.079 in	2 mm	Shrouded - 4 Wall	Black	0.079 in	2 mm	Phosphor Bronze	36	Square	Male Pin	2
Samtec Inc. T2M-118-01-L-D-RA-WT	Liquid Crystal Polymer (LCP)	Solder	Gold	3.8 A	Push-Pull	All	10 çin	0.25 çm	-55 °C	125 °C	Header	Board to Board Cable	Solder Retention	Tin	Through Hole Right Angle			0.079 in	2 mm	Shrouded - 4 Wall	Black	0.079 in	2 mm	Phosphor Bronze	36	Square	Male Pin	2	7.44 mm	0.293 in	0.09 "	2.29 mm
Samtec Inc. T2M-118-01-S-D-SM-WT-K-TR	Liquid Crystal Polymer (LCP)	Solder	Gold	3.8 A	Push-Pull	All	30 Áin	0.76 Ám	-55 °C	125 °C	Header	Board to Board Cable	Pick and Place Solder Retention	Tin	Surface Mount	5.8 mm	0.228 in	0.079 in	2 mm	Shrouded - 4 Wall	Black	0.079 in	2 mm	Phosphor Bronze	36	Square	Male Pin	2
Samtec Inc. T2M-118-01-S-D-SM-WT-K	Liquid Crystal Polymer (LCP)	Solder	Gold	3.8 A	Push-Pull	All	30 Áin	0.76 Ám	-55 °C	125 °C	Header	Board to Board Cable	Pick and Place Solder Retention	Tin	Surface Mount	5.8 mm	0.228 in	0.079 in	2 mm	Shrouded - 4 Wall	Black	0.079 in	2 mm	Phosphor Bronze	36	Square	Male Pin	2