32-6572 Series

Catalog

CONN IC DIP SOCKET ZIF 32POS TIN

Part	Termination Post Length	Material Flammability Rating	Current Rating	Contact Material - Post	Contact Finish Thickness - Post	Features	Mounting Type	Contact Finish - Post	Termination	Pitch - Mating	Housing Material	Row Spacing	Type	Contact Finish - Mating	Pitch - Post	Grid Columns	Number of Positions or Pins (Grid)	Grid Rows	Contact Material - Mating	Contact Finish Thickness - Mating
Aries Electronics 32-6572-16	0.11 in	UL94 V-0	1 A	Beryllium Copper	200 µin	Closed Frame	Through Hole	Tin	Solder	0.1 in	Glass Filled Polyphenylene Sulfide PPS	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Tin	0.1 in	16	32	2	Beryllium Copper	200 Ąin
Aries Electronics 32-6572-10	0.11 in	UL94 V-0	1 A	Beryllium Copper	200 µin	Closed Frame	Through Hole	Tin	Solder	0.1 in	Glass Filled Polyphenylene Sulfide PPS	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Tin	0.1 in	16	32	2	Beryllium Copper	200 Ąin