70-5022 Series
Manufacturer: Kester Solder
Beta
⌘K
SOLDER PASTE WP616 500GM JAR
| Part | Shipping Info | Flux Type | Mesh Type | Storage/Refrigeration Temperature (Maximum) | Storage/Refrigeration Temperature (Minimum) | Shelf Life | Ag Composition | Composition Elements | Composition Formula | Cu Composition | Sn Composition | Shelf Life Start | Form Weight | Form | Process | Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Kester Solder | Ships with Cold Pack. To ensure customer satisfaction and product integrity air shipment is recommended. | Water Soluble | 4 | 50 °F | 32 °F | 6 Months | 3 % | Ag Cu Sn | Sn96.5Ag3Cu0.5 | 0.5 % | 96.5 % | Date of Manufacture | 17.64 oz | Jar | Lead Free | Solder Paste |