CONN IC DIP SOCKET 10POS GOLD
| Part | Housing Material | Operating Temperature [Max] | Operating Temperature [Min] | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Termination Post Length | Termination Post Length | Termination | Current Rating (Amps) | Contact Finish - Mating | Material Flammability Rating | Features | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Material - Post [custom] | Type | Type | Type | Pitch - Mating | Pitch - Mating | Contact Finish - Post | Pitch - Post | Pitch - Post | Contact Material - Mating | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Glass Filled Nylon 4/6 Polyamide (PA46) | 105 ░C | -55 °C | 200 µin | 5.08 µm | 3.56 mm | 0.14 in | Solder | 3 A | Gold | UL94 V-0 | Closed Frame | 30 Áin | 0.76 Ám | Brass | DIP | 0.6 in | 15.24 mm | 0.1 in | 2.54 mm | Tin | 2.54 mm | 0.1 in | Beryllium Copper | 2 x 5 | 10 | |
Aries Electronics | Polyamide (PA46) Nylon 4/6 | 200 µin | 5.08 µm | 3.68 mm | 0.145 " | Solder | 1.5 A | UL94 V-0 | Closed Frame | 200 µin | 5.08 µm | DIP | 0.6 in | 15.24 mm | 0.1 in | 2.54 mm | Tin | 2.54 mm | 0.1 in | Phosphor Bronze | 2 x 5 | 10 | Phosphor Bronze |