SS-108 Series
Manufacturer: Samtec Inc.
Beta
⌘K
SOCKET STRIPS
| Part | Number of Positions Loaded | Style | Connector Type | Contact Finish - Mating | Termination | Number of Rows | Fastening Type | Contact Type | Insulation Color | Contact Length - Post | Number of Positions | Mounting Type | Contact Finish Thickness - Mating | Pitch - Mating | Contact Finish - Post | Operating Temperature (Max) | Operating Temperature (Min) | Insulation Height | Insulation Material | Contact Finish Thickness - Post | Contact Shape | Contact Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Samtec Inc. | All | Board | Receptacle | Gold | Solder | 1 | Push-Pull | Female Socket | Black | 0.123 in | 8 | Through Hole | 30 µin | 0.1 in | Gold | 125 °C | -55 °C | 0.1 in | Glass Filled Polybutylene Terephthalate (PBT) | 10 µin | Circular | Beryllium Copper |
Samtec Inc. | All | Board | Receptacle | Gold | Solder | 1 | Push-Pull | Female Socket | Black | 0.173 in | 8 | Through Hole | 30 µin | 0.1 in | Tin | 125 °C | -55 °C | 0.1 in | Glass Filled Polybutylene Terephthalate (PBT) | Circular | Beryllium Copper | |
 Samtec Inc. | All | Board | Receptacle | Tin | Solder | 1 | Push-Pull | Female Socket | Black | 0.51 in | 8 | Through Hole | 0.1 in | Tin | 125 °C | -55 °C | 0.1 in | Glass Filled Polybutylene Terephthalate (PBT) | Circular | Beryllium Copper | ||
Samtec Inc. | All | Board | Receptacle | Gold | Solder | 1 | Push-Pull | Female Socket | Black | 0.125 in | 8 | Through Hole | 10 µin | 0.1 in | Tin | 125 °C | -55 °C | 0.1 in | Glass Filled Polybutylene Terephthalate (PBT) | Circular | Beryllium Copper | |
Samtec Inc. | All | Board | Receptacle | Gold | Solder | 1 | Push-Pull | Female Socket | Black | 0.36 in | 8 | Through Hole | 30 µin | 0.1 in | Gold | 125 °C | -55 °C | 0.1 in | Glass Filled Polybutylene Terephthalate (PBT) | 10 µin | Circular | Beryllium Copper |
Samtec Inc. | All | Board | Receptacle | Tin | Solder | 1 | Push-Pull | Female Socket | Black | 0.26 in | 8 | Through Hole | 0.1 in | Tin | 125 °C | -55 °C | 0.1 in | Glass Filled Polybutylene Terephthalate (PBT) | Circular | Beryllium Copper | ||
Samtec Inc. | All | Board | Receptacle | Gold | Solder | 1 | Push-Pull | Female Socket | Black | 0.125 in | 8 | Through Hole | 30 µin | 0.1 in | Tin | 125 °C | -55 °C | 0.1 in | Glass Filled Polybutylene Terephthalate (PBT) | Circular | Beryllium Copper | |
Samtec Inc. | All | Board | Receptacle | Gold | Solder | 1 | Push-Pull | Female Socket | Black | 0.36 in | 8 | Through Hole | 30 µin | 0.1 in | Tin | 125 °C | -55 °C | 0.1 in | Glass Filled Polybutylene Terephthalate (PBT) | Circular | Beryllium Copper | |
Samtec Inc. | All | Board | Receptacle | Gold | Solder | 1 | Push-Pull | Female Socket | Black | 0.18 in | 8 | Through Hole | 30 µin | 0.1 in | Tin | 125 °C | -55 °C | 0.1 in | Glass Filled Polybutylene Terephthalate (PBT) | Circular | Beryllium Copper | |
Samtec Inc. | All | Board | Receptacle | Gold | Solder | 1 | Push-Pull | Female Socket | Black | 0.26 in | 8 | Through Hole | 30 µin | 0.1 in | Gold | 125 °C | -55 °C | 0.1 in | Glass Filled Polybutylene Terephthalate (PBT) | 10 µin | Circular | Beryllium Copper |