ESQT-116 Series

Catalog

CONN SOCKET 32POS 0.079 GOLD PCB

Part	Contact Type	Operating Temperature [Min]	Operating Temperature [Max]	Mounting Type	Contact Length - Post	Contact Length - Post	Termination	Insulation Height	Insulation Height	Style	Contact Finish - Post	Current Rating (Amps)	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Mating [x]	Pitch - Mating [x]	Row Spacing - Mating	Row Spacing - Mating	Connector Type	Contact Finish - Mating	Contact Material	Number of Positions Loaded	Material Flammability Rating	Insulation Color	Fastening Type	Number of Rows	Contact Shape	Insulation Material	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Length - Post [x]	Contact Length - Post [x]	Number of Positions	Number of Positions Loaded	Number of Positions
Samtec Inc. ESQT-116-02-L-D-310	Forked	-55 °C	125 °C	Through Hole	0.54 in	13.72 mm	Solder	0.31 in	7.87 mm	Board to Board Cable	Tin	4.5 A	10 çin	0.25 çm	0.079 in	2 mm	0.079 in	2 mm	Elevated Socket	Gold	Phosphor Bronze	All	UL94 V-0	Black	Push-Pull	2	Square	Liquid Crystal Polymer (LCP)
Samtec Inc. ESQT-116-02-G-D-310	Forked	-55 °C	125 °C	Through Hole	0.54 in	13.72 mm	Solder	0.31 in	7.87 mm	Board to Board Cable	Gold	4.5 A	20 µin	0.51 µm	0.079 in	2 mm	0.079 in	2 mm	Elevated Socket	Gold	Phosphor Bronze	All	UL94 V-0	Black	Push-Pull	2	Square	Liquid Crystal Polymer (LCP)	3 µin	0.076 µm
Samtec Inc. ESQT-116-02-L-D-435	Forked	-55 °C	125 °C	Through Hole	0.415 in	10.54 mm	Solder	0.435 in	11.05 mm	Board to Board Cable	Tin	4.5 A	10 çin	0.25 çm	0.079 in	2 mm	0.079 in	2 mm	Elevated Socket	Gold	Phosphor Bronze	All	UL94 V-0	Black	Push-Pull	2	Square	Liquid Crystal Polymer (LCP)
Samtec Inc. ESQT-116-02-G-S-530	Forked	-55 °C	125 °C	Through Hole			Solder	0.53 in	13.46 mm	Board to Board Cable	Gold	4.5 A	20 µin	0.51 µm	0.079 in	2 mm			Elevated Socket	Gold	Phosphor Bronze	All	UL94 V-0	Black	Push-Pull	1	Square	Liquid Crystal Polymer (LCP)	3 µin	0.076 µm	0.32 in	8.13 mm	16
Samtec Inc. ESQT-116-02-G-D-720	Forked	-55 °C	125 °C	Through Hole	0.13 in	3.3 mm	Solder	0.72 in	18.3 mm	Board to Board Cable	Gold	4.5 A	20 µin	0.51 µm	0.079 in	2 mm	0.079 in	2 mm	Elevated Socket	Gold	Phosphor Bronze	All	UL94 V-0	Black	Push-Pull	2	Square	Liquid Crystal Polymer (LCP)	3 µin	0.076 µm
Samtec Inc. ESQT-116-02-L-D-790	Forked	-55 °C	125 °C	Through Hole			Solder	0.79 in	20.07 mm	Board to Board Cable	Tin	4.5 A	10 çin	0.25 çm	0.079 in	2 mm	0.079 in	2 mm	Elevated Socket	Gold	Phosphor Bronze	All	UL94 V-0	Black	Push-Pull	2	Square	Liquid Crystal Polymer (LCP)			0.06 in	1.52 mm
Samtec Inc. ESQT-116-02-F-D-760	Forked	-55 °C	125 °C	Through Hole	0.09 "	2.29 mm	Solder	0.76 in	19.3 mm	Board to Board Cable	Tin	4.5 A	3 µin	0.076 µm	0.079 in	2 mm	0.079 in	2 mm	Elevated Socket	Gold	Phosphor Bronze	All	UL94 V-0	Black	Push-Pull	2	Square	Liquid Crystal Polymer (LCP)
Samtec Inc. ESQT-116-03-G-D-408-001	Forked	-55 °C	125 °C	Through Hole	0.05 in	1.27 mm	Solder	0.408 in	10.36 mm	Board to Board Cable	Gold	4.5 A	20 µin	0.51 µm	0.079 in	2 mm	0.079 in	2 mm	Elevated Socket	Gold	Phosphor Bronze		UL94 V-0	Black	Push-Pull	2	Square	Liquid Crystal Polymer (LCP)	3 µin	0.076 µm				31
Samtec Inc. ESQT-116-02-L-Q-770	Forked	-55 °C	125 °C	Through Hole	0.08 in	2.03 mm	Solder	0.77 in	19.56 mm	Board to Board Cable	Tin	4.5 A	10 çin	0.25 çm	0.079 in	2 mm	0.079 in	2 mm	Elevated Socket	Gold	Phosphor Bronze	All	UL94 V-0	Black	Push-Pull		Square	Liquid Crystal Polymer (LCP)							64
Samtec Inc. ESQT-116-03-G-D-368	Forked	-55 °C	125 °C	Through Hole	0.09 "	2.29 mm	Solder	0.368 in	9.35 mm	Board to Board Cable	Gold	4.5 A	20 µin	0.51 µm	0.079 in	2 mm	0.079 in	2 mm	Elevated Socket	Gold	Phosphor Bronze	All	UL94 V-0	Black	Push-Pull	2	Square	Liquid Crystal Polymer (LCP)	3 µin	0.076 µm