XCV300E Series
Manufacturer: AMD / Xilinx
IC FPGA 176 I/O 256FBGA
| Part | Package / Case | Number of Gates | Number of I/O | Operating Temperature (Max) | Operating Temperature (Min) | Package Width | Package Name | Package Length | Number of Logic Elements/Cells | Voltage - Supply (Maximum) | Voltage - Supply (Minimum) | Mounting Type | Total RAM Bits | Number of LABs/CLBs |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
AMD / Xilinx | 256-BGA | 411955 | 176 | 100 °C | -40 °C | 17 mm | 256-FBGA | 17 mm | 6912 | 1.89 V | 1.71 V | Surface Mount | 131072 bits | 1536 |
AMD / Xilinx | 240-BFQFP | 411955 | 158 | 100 °C | -40 °C | 32 mm | 240-PQFP | 32 mm | 6912 | 1.89 V | 1.71 V | Surface Mount | 131072 bits | 1536 |
AMD / Xilinx | 432-LBGA Exposed Pad Metal | 411955 | 316 | 85 °C | 0 °C | 40 mm | 432-MBGA | 40 mm | 6912 | 1.89 V | 1.71 V | Surface Mount | 131072 bits | 1536 |
AMD / Xilinx | 240-BFQFP | 411955 | 158 | 85 °C | 0 °C | 32 mm | 240-PQFP | 32 mm | 6912 | 1.89 V | 1.71 V | Surface Mount | 131072 bits | 1536 |
AMD / Xilinx | 456-BBGA | 411955 | 312 | 85 °C | 0 °C | 23 mm | 456-FBGA | 23 mm | 6912 | 1.89 V | 1.71 V | Surface Mount | 131072 bits | 1536 |
AMD / Xilinx | 432-LBGA Exposed Pad Metal | 411955 | 316 | 100 °C | -40 °C | 40 mm | 432-MBGA | 40 mm | 6912 | 1.89 V | 1.71 V | Surface Mount | 131072 bits | 1536 |
AMD / Xilinx | 432-LBGA Exposed Pad Metal | 411955 | 316 | 85 °C | 0 °C | 40 mm | 432-MBGA | 40 mm | 6912 | 1.89 V | 1.71 V | Surface Mount | 131072 bits | 1536 |
AMD / Xilinx | 432-LBGA Exposed Pad Metal | 411955 | 316 | 100 °C | -40 °C | 40 mm | 432-MBGA | 40 mm | 6912 | 1.89 V | 1.71 V | Surface Mount | 131072 bits | 1536 |
AMD / Xilinx | 256-BGA | 411955 | 176 | 100 °C | -40 °C | 17 mm | 256-FBGA | 17 mm | 6912 | 1.89 V | 1.71 V | Surface Mount | 131072 bits | 1536 |
AMD / Xilinx | 240-BFQFP | 411955 | 158 | 100 °C | -40 °C | 32 mm | 240-PQFP | 32 mm | 6912 | 1.89 V | 1.71 V | Surface Mount | 131072 bits | 1536 |