TMMH-113 Series

Catalog

2MM LOW PROFILE STRIPS

Part	Operating Temperature (Max)	Operating Temperature (Min)	Insulation Material	Row Spacing - Mating	Contact Finish - Mating	Material Flammability Rating	Number of Positions	Insulation Color	Contact Finish - Post	Pitch - Mating	Contact Material	Fastening Type	Termination	Mounting Type	Style	Insulation Height	Features	Contact Type	Shrouding	Number of Positions Loaded	Number of Rows	Contact Finish Thickness - Mating	Connector Type	Contact Length - Mating	Contact Shape	Contact Finish Thickness - Post	Contact Length - Post	Overall Contact Length
Samtec Inc. TMMH-113-01-L-DV-LC	125 °C	-55 °C	Liquid Crystal Polymer (LCP)	0.079 in	Gold	UL94 V-0	26	Black	Tin	0.079 in	Phosphor Bronze	Push-Pull	Solder	Surface Mount	Board Board or Cable	0.079 in	Board Lock	Male Pin	Unshrouded	All	2	10 µin	Cuttable Header	0.126 in	Square
Samtec Inc. TMMH-113-01-G-DV-TR	125 °C	-55 °C	Liquid Crystal Polymer (LCP)	0.079 in	Gold	UL94 V-0	26	Black	Gold	0.079 in	Phosphor Bronze	Push-Pull	Solder	Surface Mount	Board Board or Cable	0.079 in		Male Pin	Unshrouded	All	2	20 Ąin	Cuttable Header	0.126 in	Square	3 µin
Samtec Inc. TMMH-113-01-L-DV-ES-A	125 °C	-55 °C	Liquid Crystal Polymer (LCP)	0.079 in	Gold	UL94 V-0	26	Black	Tin	0.079 in	Phosphor Bronze	Push-Pull	Solder	Surface Mount	Board Board or Cable	0.079 in	Board Guide End Shrouds	Male Pin	Unshrouded	All	2	10 µin	Cuttable Header	0.126 in	Square
Samtec Inc. TMMH-113-01-G-DV-ES-A	125 °C	-55 °C	Liquid Crystal Polymer (LCP)	0.079 in	Gold	UL94 V-0	26	Black	Gold	0.079 in	Phosphor Bronze	Push-Pull	Solder	Surface Mount	Board Board or Cable	0.079 in	Board Guide End Shrouds	Male Pin	Unshrouded	All	2	20 Ąin	Cuttable Header	0.126 in	Square	3 µin
Samtec Inc. TMMH-113-06-G-D	125 °C	-55 °C	Liquid Crystal Polymer (LCP)	0.079 in	Gold	UL94 V-0	26	Black	Gold	0.079 in	Phosphor Bronze	Push-Pull	Solder	Through Hole	Board Board or Cable	0.079 in		Male Pin	Unshrouded	All	2	20 Ąin	Cuttable Header	0.126 in	Square	3 µin	0.139 in	0.344 in
Samtec Inc. TMMH-113-05-L-DV-ES-A	125 °C	-55 °C	Liquid Crystal Polymer (LCP)	0.079 in	Gold	UL94 V-0	26	Black	Tin	0.079 in	Phosphor Bronze	Push-Pull	Solder	Surface Mount	Board Board or Cable	0.079 in	Board Guide End Shrouds	Male Pin	Unshrouded	All	2	10 µin	Cuttable Header	0.065 in	Square
Samtec Inc. TMMH-113-06-F-Q	125 °C	-55 °C	Liquid Crystal Polymer (LCP)	0.079 in	Gold	UL94 V-0	52	Black	Tin	0.079 in	Phosphor Bronze	Push-Pull	Solder	Through Hole	Board Board or Cable	0.079 in		Male Pin	Unshrouded	All	4	3 µin	Cuttable Header	0.126 in	Square		0.139 in	0.344 in
Samtec Inc. TMMH-113-04-G-D-RA	125 °C	-55 °C	Liquid Crystal Polymer (LCP)	0.079 in	Gold	UL94 V-0	26	Black	Gold	0.079 in	Phosphor Bronze	Push-Pull	Solder	Right Angle Through Hole	Board Board or Cable	0.157 in		Male Pin	Unshrouded	All	2	20 Ąin	Cuttable Header	0.075 in	Square	3 µin	0.103 in
Samtec Inc. TMMH-113-06-L-D-RC	125 °C	-55 °C	Liquid Crystal Polymer (LCP)	0.079 in	Gold	UL94 V-0	26	Black	Tin	0.079 in	Phosphor Bronze	Latch Lock	Solder	Through Hole	Board Board or Cable	0.079 in		Male Pin	Unshrouded	All	2	10 µin	Cuttable Header	0.126 in	Square		0.139 in	0.344 in
Samtec Inc. TMMH-113-01-F-D	125 °C	-55 °C	Liquid Crystal Polymer (LCP)	0.079 in	Gold	UL94 V-0	26	Black	Tin	0.079 in	Phosphor Bronze	Push-Pull	Solder	Through Hole	Board Board or Cable	0.079 in		Male Pin	Unshrouded	All	2	3 µin	Cuttable Header	0.126 in	Square		0.097 in	0.302 in