658-25 Series
Manufacturer: Wakefield Thermal Solutions
HEATSINK CPU 28MM SQ BLK
| Part | Material Finish | Power Dissipation | Thermal Resistance | Shape | Material | Length | Type | Fin Height | Attachment Method | Width | Package Cooled |
|---|---|---|---|---|---|---|---|---|---|---|---|
Wakefield Thermal Solutions | Black Anodized | 2 W | 5 °C/W | Pin Fins Square | Aluminum | 1.1 in | Top Mount | 0.25 in | Adhesive (Not Included) Thermal Tape | 1.1 in | BGA |
Wakefield Thermal Solutions | Black Anodized | 2 W | 5 °C/W | Pin Fins Square | Aluminum | 1.1 in | Top Mount | 0.25 in | Adhesive (Not Included) Thermal Tape | 1.1 in | BGA |