TFM-112 Series

Catalog

CONN HEADER SMD 24POS 1.27MM

Part	Contact Length - Mating	Contact Length - Mating	Termination	Number of Positions Loaded	Contact Material	Insulation Height	Insulation Height	Contact Finish - Post	Operating Temperature [Min]	Operating Temperature [Max]	Mounting Type	Shrouding	Features	Number of Positions	Connector Type	Insulation Color	Number of Rows	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Type	Voltage Rating	Row Spacing - Mating	Row Spacing - Mating	Pitch - Mating	Pitch - Mating	Fastening Type	Material Flammability Rating	Current Rating (Amps)	Insulation Material	Contact Finish - Mating	Style	Contact Shape	Contact Length - Post [x]	Contact Length - Post [x]	Contact Length - Post	Contact Length - Post
Samtec Inc. TFM-112-02-L-D-WT-K	3.33 mm	0.131 in	Solder	All	Phosphor Bronze	5.6 mm	0.22 in	Tin	-55 °C	125 °C	Surface Mount	Shrouded - 4 Wall	Pick and Place Solder Retention	24	Header	Black	2	15 µin	0.38 µm	Male Pin	275 VAC	0.05 in	1.27 mm	0.05 in	1.27 mm	Push-Pull	UL94 V-0	2.9 A	Liquid Crystal Polymer (LCP)	Gold	Board to Board Cable	Square
Samtec Inc. TFM-112-01-S-S	3.33 mm	0.131 in	Solder	All	Phosphor Bronze	5.6 mm	0.22 in	Tin	-55 °C	125 °C	Through Hole	Shrouded - 4 Wall		12	Header	Black	1	30 Áin	0.76 Ám	Male Pin	275 VAC			0.05 in	1.27 mm	Push-Pull	UL94 V-0	2.9 A	Liquid Crystal Polymer (LCP)	Gold	Board to Board Cable	Square	0.078 in	1.98 mm
Samtec Inc. TFM-112-03-L-D-WT	3.53 mm	0.139 in	Solder	All	Phosphor Bronze	5.6 mm	0.22 in	Tin	-55 °C	125 °C	Through Hole	Shrouded - 4 Wall	Solder Retention	24	Header	Black	2	15 µin	0.38 µm	Male Pin	275 VAC	0.05 in	1.27 mm	0.05 in	1.27 mm	Push-Pull	UL94 V-0	2.9 A	Liquid Crystal Polymer (LCP)	Gold	Board to Board Cable	Square			0.111 in	2.82 mm
Samtec Inc. TFM-112-32-L-D-A-K-TR	3.53 mm	0.139 in	Solder	All	Phosphor Bronze	11.05 mm	0.435 in	Tin	-55 °C	125 °C	Surface Mount	Shrouded - 4 Wall	Board Guide Pick and Place	24	Header	Black	2	15 µin	0.38 µm	Male Pin	275 VAC	0.05 in	1.27 mm	0.05 in	1.27 mm	Push-Pull	UL94 V-0	2.9 A	Liquid Crystal Polymer (LCP)	Gold	Board to Board Cable	Square
Samtec Inc. TFM-112-01-L-D-RA	3.61 mm	0.142 in	Solder	All	Phosphor Bronze	5.72 mm	0.225 in	Tin	-55 °C	125 °C	Through Hole Right Angle	Shrouded - 4 Wall		24	Header	Black	2	15 µin	0.38 µm	Male Pin	275 VAC	0.05 in	1.27 mm	0.05 in	1.27 mm	Push-Pull	UL94 V-0	2.9 A	Liquid Crystal Polymer (LCP)	Gold	Board to Board Cable	Square	0.075 in			1.91 mm
Samtec Inc. TFM-112-01-S-D	3.33 mm	0.131 in	Solder	All	Phosphor Bronze	5.6 mm	0.22 in	Tin	-55 °C	125 °C	Through Hole	Shrouded - 4 Wall		24	Header	Black	2	30 Áin	0.76 Ám	Male Pin	275 VAC	0.05 in	1.27 mm	0.05 in	1.27 mm	Push-Pull	UL94 V-0	2.9 A	Liquid Crystal Polymer (LCP)	Gold	Board to Board Cable	Square	0.078 in	1.98 mm
Samtec Inc. TFM-112-02-S-D-WT-P-TR	3.33 mm	0.131 in	Solder	All	Phosphor Bronze	5.6 mm	0.22 in	Tin	-55 °C	125 °C	Surface Mount	Shrouded - 4 Wall	Pick and Place Solder Retention	24	Header	Black	2	30 Áin	0.76 Ám	Male Pin	275 VAC	0.05 in	1.27 mm	0.05 in	1.27 mm	Push-Pull	UL94 V-0	2.9 A	Liquid Crystal Polymer (LCP)	Gold	Board to Board Cable	Square
Samtec Inc. TFM-112-02-S-D-DS	3.33 mm	0.131 in	Solder	All	Phosphor Bronze	5.6 mm	0.22 in	Tin	-55 °C	125 °C	Surface Mount	Shrouded - 4 Wall	Mating Flange	24	Header	Black	2	30 Áin	0.76 Ám	Male Pin	275 VAC	0.05 in	1.27 mm	0.05 in	1.27 mm	Push-Pull	UL94 V-0	2.9 A	Liquid Crystal Polymer (LCP)	Gold	Board to Board Cable	Square
Samtec Inc. TFM-112-02-S-D	3.33 mm	0.131 in	Solder	All	Phosphor Bronze	5.6 mm	0.22 in	Tin	-55 °C	125 °C	Surface Mount	Shrouded - 4 Wall		24	Header	Black	2	30 Áin	0.76 Ám	Male Pin	275 VAC	0.05 in	1.27 mm	0.05 in	1.27 mm	Push-Pull	UL94 V-0	2.9 A 3.2 A	Liquid Crystal Polymer (LCP)	Gold	Board to Board Cable	Square
Samtec Inc. TFM-112-03-L-D-A	3.53 mm	0.139 in	Solder	All	Phosphor Bronze	5.6 mm	0.22 in	Tin	-55 °C	125 °C	Through Hole	Shrouded - 4 Wall	Board Guide	24	Header	Black	2	15 µin	0.38 µm	Male Pin	275 VAC	0.05 in	1.27 mm	0.05 in	1.27 mm	Push-Pull	UL94 V-0	2.9 A	Liquid Crystal Polymer (LCP)	Gold	Board to Board Cable	Square			0.111 in	2.82 mm