MMPF0200 Series
Manufacturer: NXP USA Inc.
POWER MANAGEMENT IC, I.MX6, PRE-PROG, 12 CH, 3/4 BUCK, 6 LDO, 1 BOOST, QFN 56/ REEL ROHS COMPLIANT: YES
| Part | Voltage - Output | Applications | Package / Case | Mounting Type | Operating Temperature (Max) | Operating Temperature (Min) | Number of Outputs | Voltage - Input (Maximum) | Voltage - Input (Minimum) | Package Width | Package Name | Package Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP USA Inc. | Multiple | Converter i.MX6 | 56-VFQFN Exposed Pad | Surface Mount | 85 °C | -40 °C | 11 | 4.5 V | 2.8 V | 8 mm | 56-HVQFN | 8 mm |
NXP USA Inc. | Multiple | Converter i.MX6 | 56-VFQFN Exposed Pad | Surface Mount | 85 °C | -40 °C | 11 | 4.5 V | 2.8 V | 8 mm | 56-HVQFN | 8 mm |
NXP USA Inc. | Multiple | Converter i.MX6 | 56-VFQFN Exposed Pad | Surface Mount | 85 °C | -40 °C | 11 | 4.5 V | 2.8 V | 8 mm | 56-HVQFN | 8 mm |
NXP USA Inc. | Multiple | Converter i.MX6 | 56-VFQFN Exposed Pad | Surface Mount Wettable Flank | 85 °C | -40 °C | 11 | 4.5 V | 2.8 V | 8 mm | 56-QFN-EP | 8 mm |
NXP USA Inc. | Multiple | Converter i.MX6 | 56-VFQFN Exposed Pad | Surface Mount Wettable Flank | 85 °C | -40 °C | 11 | 4.5 V | 2.8 V | 8 mm | 56-QFN-EP | 8 mm |
NXP USA Inc. | Multiple | Converter i.MX6 | 56-VFQFN Exposed Pad | Surface Mount | 85 °C | -40 °C | 11 | 4.5 V | 2.8 V | 8 mm | 56-HVQFN | 8 mm |
NXP USA Inc. | Multiple | Converter i.MX6 | 56-VFQFN Exposed Pad | Surface Mount | 85 °C | -40 °C | 11 | 4.5 V | 2.8 V | 8 mm | 56-HVQFN | 8 mm |
NXP USA Inc. | Multiple | Converter i.MX6 | 56-VFQFN Exposed Pad | Surface Mount Wettable Flank | 105 °C | -40 °C | 11 | 4.5 V | 2.8 V | 8 mm | 56-QFN-EP | 8 mm |
NXP USA Inc. | Multiple | Converter i.MX6 | 56-VFQFN Exposed Pad | Surface Mount | 85 °C | -40 °C | 11 | 4.5 V | 2.8 V | 8 mm | 56-HVQFN | 8 mm |