64-9508 Series
Manufacturer: Aries Electronics
CONN IC DIP SOCKET 64POS GOLD
| Part | Termination Post Length | Material Flammability Rating | Current Rating | Contact Finish - Post | Termination | Housing Material | Operating Temperature (Min) | Operating Temperature (Max) | Pitch - Post | Contact Material - Post | Mounting Type | Grid Columns | Grid Rows | Number of Positions or Pins (Grid) | Row Spacing | Type | Contact Finish Thickness - Post | Features | Pitch - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Contact Finish - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 0.5 in | UL94 V-0 | 3 A | Tin | Wire Wrap | Glass Filled Nylon 4/6 PA46 Polyamide | -55 °C | 105 °C | 0.1 in | Brass | Through Hole | 32 | 2 | 64 | 0.9 in | 0.9" (22.86mm) Row Spacing DIP | 200 µin | Open Frame | 0.1 in | 30 µin | Beryllium Copper | Gold |
Aries Electronics | 0.36 in | UL94 V-0 | 3 A | Gold | Wire Wrap | Glass Filled Nylon 4/6 PA46 Polyamide | -55 °C | 125 °C | 0.1 in | Brass | Through Hole | 32 | 2 | 64 | 0.9 in | 0.9" (22.86mm) Row Spacing DIP | 10 µin | Open Frame | 0.1 in | 30 µin | Beryllium Copper | Gold |
Aries Electronics | 0.36 in | UL94 V-0 | 3 A | Tin | Wire Wrap | Glass Filled Nylon 4/6 PA46 Polyamide | -55 °C | 105 °C | 0.1 in | Brass | Through Hole | 32 | 2 | 64 | 0.9 in | 0.9" (22.86mm) Row Spacing DIP | 200 µin | Open Frame | 0.1 in | 30 µin | Beryllium Copper | Gold |
Aries Electronics | 0.5 in | UL94 V-0 | 3 A | Gold | Wire Wrap | Glass Filled Nylon 4/6 PA46 Polyamide | -55 °C | 125 °C | 0.1 in | Brass | Through Hole | 32 | 2 | 64 | 0.9 in | 0.9" (22.86mm) Row Spacing DIP | 10 µin | Open Frame | 0.1 in | 30 µin | Beryllium Copper | Gold |