CONN HEADER SMD 114POS 0.8MM
| Part | Number of Rows | Insulation Material | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Mounting Type | Features | Contact Material | Material Flammability Rating | Current Rating (Amps) | Termination | Insulation Color | Shrouding | Pitch - Mating | Pitch - Mating | Contact Finish - Mating | Row Spacing - Mating | Row Spacing - Mating | Insulation Height [z] | Insulation Height [z] | Number of Positions Loaded | Contact Finish - Post | Number of Positions | Contact Type | Contact Length - Mating [x] | Contact Length - Mating [x] | Contact Shape | Connector Type | Operating Temperature [Min] | Operating Temperature [Max] | Fastening Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Insulation Height | Insulation Height |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 2 | Liquid Crystal Polymer (LCP) | 10 çin | 0.25 çm | Surface Mount | Board Guide | Phosphor Bronze | UL94 V-0 | 2.7 A | Solder | Black | Unshrouded | 0.031 in | 0.8 mm | Gold | 1.2 mm | 0.047 in | 0.055 in | 1.4 mm | All | Gold | 114 | Male Pin | 1.9 mm | 0.075 in | Square | Header | -55 °C | 125 °C | Push-Pull | ||||
Samtec Inc. | 2 | Liquid Crystal Polymer (LCP) | 10 çin | 0.25 çm | Surface Mount | Board Guide End Shrouds | Phosphor Bronze | UL94 V-0 | 2.7 A | Solder | Black | Unshrouded | 0.031 in | 0.8 mm | Gold | 1.2 mm | 0.047 in | 0.055 in | 1.4 mm | All | Gold | 114 | Male Pin | 1.9 mm | 0.075 in | Square | Header | -55 °C | 125 °C | Push-Pull | ||||
Samtec Inc. | 2 | Liquid Crystal Polymer (LCP) | 10 çin | 0.25 çm | Surface Mount Right Angle | Phosphor Bronze | UL94 V-0 | 2.7 A | Solder | Black | Unshrouded | 0.031 in | 0.8 mm | Gold | 1.2 mm | 0.047 in | All | Gold | 114 | Male Pin | 1.9 mm | 0.075 in | Square | Header | -55 °C | 125 °C | Push-Pull | 3 µin | 0.076 µm | 3.05 mm | 0.12 in |