32-C300 Series

Catalog

CONN IC DIP SOCKET 32POS GOLD

Part	Contact Material - Post [custom]	Contact Material - Mating	Pitch - Post	Pitch - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Contact Finish - Mating	Housing Material	Material Flammability Rating	Pitch - Mating	Pitch - Mating	Current Rating (Amps)	Features	Mounting Type	Operating Temperature [Max]	Operating Temperature [Min]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Type	Type	Type	Termination	Termination Post Length	Termination Post Length	Contact Finish - Post
Aries Electronics 32-C300-30	Brass	Beryllium Copper	2.54 mm	0.1 in	10 çin	0.25 çm	2 x 16	32	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	UL94 V-0	0.1 in	2.54 mm	3 A	Closed Frame	Through Hole	105 ░C	-55 °C	200 µin	5.08 µm	DIP	0.6 in	15.24 mm	Wire Wrap	0.04 in	1.02 mm	Tin
Aries Electronics 32-C300-10	Brass	Beryllium Copper	2.54 mm	0.1 in	10 çin	0.25 çm	2 x 16	32	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	UL94 V-0	0.1 in	2.54 mm	3 A	Closed Frame	Through Hole	105 ░C	-55 °C	200 µin	5.08 µm	DIP	0.6 in	15.24 mm	Solder	0.125 in	3.18 mm	Tin
Aries Electronics 32-C300-20	Brass	Beryllium Copper	2.54 mm	0.1 in	10 çin	0.25 çm	2 x 16	32	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	UL94 V-0	0.1 in	2.54 mm	3 A	Closed Frame	Through Hole	105 ░C	-55 °C	200 µin	5.08 µm	DIP	0.6 in	15.24 mm	Wire Wrap	0.04 in	1.02 mm	Tin
Aries Electronics 32-C300-11	Brass	Beryllium Copper	2.54 mm	0.1 in	10 çin	0.25 çm	2 x 16	32	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	UL94 V-0	0.1 in	2.54 mm	3 A	Closed Frame	Through Hole	125 °C	-55 °C	10 çin	0.25 çm	DIP	0.6 in	15.24 mm	Solder	0.125 in	3.18 mm	Gold
Aries Electronics 32-C300-31	Brass	Beryllium Copper	2.54 mm	0.1 in	10 çin	0.25 çm	2 x 16	32	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	UL94 V-0	0.1 in	2.54 mm	3 A	Closed Frame	Through Hole	125 °C	-55 °C	10 çin	0.25 çm	DIP	0.6 in	15.24 mm	Wire Wrap	0.04 in	1.02 mm	Gold
Aries Electronics 32-C300-21	Brass	Beryllium Copper	2.54 mm	0.1 in	10 çin	0.25 çm	2 x 16	32	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	UL94 V-0	0.1 in	2.54 mm	3 A	Closed Frame	Through Hole	125 °C	-55 °C	10 çin	0.25 çm	DIP	0.6 in	15.24 mm	Wire Wrap	0.04 in	1.02 mm	Gold
Aries Electronics 32-C300-00	Brass	Beryllium Copper	2.54 mm	0.1 in	10 çin	0.25 çm	2 x 16	32	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	UL94 V-0	0.1 in	2.54 mm	3 A	Closed Frame	Surface Mount	105 ░C	-55 °C	200 µin	5.08 µm	DIP	0.6 in	15.24 mm	Solder	0.04 in	1.02 mm	Tin