SS-120 Series
Manufacturer: Samtec Inc.
Beta
⌘K
SOCKET STRIPS
| Part | Connector Type | Number of Positions Loaded | Contact Type | Contact Finish Thickness - Mating | Style | Contact Finish - Mating | Pitch - Mating | Contact Finish - Post | Operating Temperature (Max) | Operating Temperature (Min) | Fastening Type | Termination | Number of Rows | Number of Positions | Insulation Color | Mounting Type | Contact Length - Post | Insulation Height | Contact Material | Insulation Material | Contact Finish Thickness - Post | Contact Shape | Features |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Samtec Inc. | Receptacle | All | Female Socket | 30 µin | Board | Gold | 0.1 in | Gold | 125 °C | -55 °C | Push-Pull | Solder | 1 | 20 | Black | Through Hole | 0.51 in | 0.1 in | Beryllium Copper | Glass Filled Polybutylene Terephthalate (PBT) | 10 µin | Circular | |
Samtec Inc. | Receptacle | All | Female Socket | 30 µin | Board | Gold | 0.1 in | Gold | 125 °C | -55 °C | Push-Pull | Solder | 1 | 20 | Black | Through Hole | 0.51 in | 0.1 in | Beryllium Copper | Glass Filled Polybutylene Terephthalate (PBT) | 10 µin | Circular | |
 Samtec Inc. | Receptacle | All | Female Socket | 30 µin | Board | Gold | 0.1 in | Gold | 125 °C | -55 °C | Push-Pull | Solder | 1 | 20 | Black | Through Hole | 0.51 in | 0.1 in | Beryllium Copper | Glass Filled Polybutylene Terephthalate (PBT) | 10 µin | Circular | |
 Samtec Inc. | Receptacle | All | Female Socket | Board | Tin | 0.1 in | Tin | 125 °C | -55 °C | Push-Pull | Solder | 1 | 20 | Black | Through Hole | 0.36 in | 0.1 in | Beryllium Copper | Glass Filled Polybutylene Terephthalate (PBT) | Circular | |||
Samtec Inc. | Receptacle | All | Female Socket | 30 µin | Board | Gold | 0.1 in | Tin | 125 °C | -55 °C | Push-Pull | Solder | 1 | 20 | Black | Through Hole | 0.36 in | 0.1 in | Beryllium Copper | Glass Filled Polybutylene Terephthalate (PBT) | Circular | ||
Samtec Inc. | Receptacle | All | Female Socket | Board | Tin | 0.1 in | Tin | 125 °C | -55 °C | Push-Pull | Solder | 1 | 20 | Black | Through Hole | 0.26 in | 0.1 in | Beryllium Copper | Glass Filled Polybutylene Terephthalate (PBT) | Circular | |||
Samtec Inc. | Receptacle | All | Female Socket | 30 µin | Board | Gold | 0.1 in | Tin | 125 °C | -55 °C | Push-Pull | Solder | 1 | 20 | Black | Through Hole | 0.125 in | 0.1 in | Beryllium Copper | Glass Filled Polybutylene Terephthalate (PBT) | Circular | Board Lock | |
Samtec Inc. | Receptacle | All | Female Socket | 30 µin | Board | Gold | 0.1 in | Tin | 125 °C | -55 °C | Push-Pull | Solder | 1 | 20 | Black | Through Hole | 0.125 in | 0.1 in | Beryllium Copper | Glass Filled Polybutylene Terephthalate (PBT) | Circular | ||
Samtec Inc. | Receptacle | All | Female Socket | 30 µin | Board | Gold | 0.1 in | Tin | 125 °C | -55 °C | Push-Pull | Solder | 1 | 20 | Black | Through Hole | 0.51 in | 0.1 in | Beryllium Copper | Glass Filled Polybutylene Terephthalate (PBT) | Circular | ||
Samtec Inc. | Receptacle | All | Female Socket | Board | Tin | 0.1 in | Tin | 125 °C | -55 °C | Push-Pull | Solder | 1 | 20 | Black | Through Hole | 0.51 in | 0.1 in | Beryllium Copper | Glass Filled Polybutylene Terephthalate (PBT) | Circular |