24-8900 Series
Manufacturer: Aries Electronics
CONN IC DIP SOCKET 24POS GOLD
| Part | Termination Post Length | Material Flammability Rating | Current Rating | Contact Material - Post | Termination | Contact Finish Thickness - Mating | Pitch - Mating | Grid Rows | Number of Positions or Pins (Grid) | Grid Columns | Contact Finish Thickness - Post | Operating Temperature (Min) | Operating Temperature (Max) | Row Spacing | Type | Contact Finish - Post | Contact Finish - Mating | Mounting Type | Pitch - Post | Features | Housing Material | Contact Material - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 0.14 in | UL94 V-0 | 3 A | Brass | Solder | 30 µin | 0.1 in | 2 | 24 | 12 | 10 µin | -55 °C | 105 °C | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | Gold | Gold | Through Hole | 0.1 in | Closed Frame Elevated | Glass Filled Nylon 4/6 PA46 Polyamide | Beryllium Copper |
Aries Electronics | 0.14 in | UL94 V-0 | 3 A | Brass | Solder | 30 µin | 0.1 in | 2 | 24 | 12 | 10 µin | -55 °C | 105 °C | 0.6 in | 0.6" (15.24mm) Row Spacing DIP | Gold | Gold | Through Hole | 0.1 in | Closed Frame Elevated | Glass Filled Nylon 4/6 PA46 Polyamide | Beryllium Copper |