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CONN IC DIP SOCKET 24POS GOLD
| Part | Operating Temperature [Max] | Operating Temperature [Min] | Contact Material - Post [custom] | Pitch - Mating | Pitch - Mating | Contact Material - Mating | Current Rating (Amps) | Contact Finish - Post | Number of Positions or Pins (Grid) | Pitch - Post | Pitch - Post | Housing Material | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Mating | Features | Termination Post Length | Termination Post Length | Termination | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Material Flammability Rating | Mounting Type | Type | Type | Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 105 ░C | -55 °C | Brass | 0.1 in | 2.54 mm | Beryllium Copper | 3 A | Gold | 24 | 2.54 mm | 0.1 in | Glass Filled Nylon 4/6 Polyamide (PA46) | 10 çin | 0.25 çm | Gold | Closed Frame Elevated | 3.56 mm | 0.14 in | Solder | 30 Áin | 0.76 Ám | UL94 V-0 | Through Hole | 0.3 " | 7.62 mm | DIP |
Aries Electronics | 105 ░C | -55 °C | Brass | 0.1 in | 2.54 mm | Beryllium Copper | 3 A | Gold | 24 | 2.54 mm | 0.1 in | Glass Filled Nylon 4/6 Polyamide (PA46) | 10 çin | 0.25 çm | Gold | Closed Frame Elevated | 3.56 mm | 0.14 in | Solder | 30 Áin | 0.76 Ám | UL94 V-0 | Through Hole | 0.6 in | 15.24 mm | DIP |