Beta
⌘K
CONN SOCKET PGA ZIF GOLD
| Part | Pitch - Mating | Pitch - Mating | Features | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Mating | Termination | Operating Temperature [Max] | Operating Temperature [Min] | Type | Contact Material - Post | Contact Material - Mating | Current Rating (Amps) | Mounting Type | Pitch - Post | Pitch - Post | Termination Post Length | Termination Post Length | Contact Finish - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Material Flammability Rating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 0.1 in | 2.54 mm | Closed Frame | 200 µin | 5.08 µm | Gold | Solder | 125 °C | -65 ░C | PGA ZIF (ZIP) | Beryllium Copper | Beryllium Copper | 1 A | Through Hole | 2.54 mm | 0.1 in | 3.18 mm | 0.125 in | Tin | 30 Áin | 0.76 Ám | UL94 V-0 |