40-6573 Series

Catalog

CONN IC DIP SOCKET ZIF 40POS TIN

Part	Termination Post Length	Current Rating	Material Flammability Rating	Contact Material - Post	Contact Finish - Mating	Pitch - Post	Contact Material - Mating	Contact Finish Thickness - Mating	Grid Columns	Number of Positions or Pins (Grid)	Grid Rows	Contact Finish Thickness - Post	Housing Material	Features	Pitch - Mating	Row Spacing	Type	Mounting Type	Termination	Contact Finish - Post
Aries Electronics 40-6573-16	0.11 in	1 A	UL94 V-0	Beryllium Copper	Tin	0.1 in	Beryllium Copper	200 Ąin	20	40	2	200 µin	Glass Filled Polyphenylene Sulfide PPS	Closed Frame	0.1 in	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Through Hole	Solder	Tin
Aries Electronics 40-6573-11	0.11 in	1 A	UL94 V-0	Beryllium Copper	Tin	0.1 in	Beryllium Copper	200 Ąin	20	40	2	200 µin	Glass Filled Polyphenylene Sulfide PPS	Closed Frame	0.1 in	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Through Hole	Solder	Tin