40-6573 Series

Catalog

CONN IC DIP SOCKET ZIF 40POS TIN

Part	Termination	Housing Material	Pitch - Mating	Pitch - Mating	Contact Material - Post	Pitch - Post	Pitch - Post	Termination Post Length	Termination Post Length	Features	Contact Finish - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Mounting Type	Type	Type	Type	Current Rating (Amps)	Material Flammability Rating	Contact Material - Mating
Aries Electronics 40-6573-16	Solder	Polyphenylene Sulfide (PPS) Glass Filled	0.1 in	2.54 mm	Beryllium Copper	2.54 mm	0.1 in	0.11 in	2.78 mm	Closed Frame	Tin	200 µin	5.08 µm	40	20	2	5.08 µm	200 µin	Through Hole	15.24 mm	DIP ZIF (ZIP)	0.6 "	1 A	UL94 V-0	Beryllium Copper
Aries Electronics 40-6573-11	Solder	Polyphenylene Sulfide (PPS) Glass Filled	0.1 in	2.54 mm	Beryllium Copper	2.54 mm	0.1 in	0.11 in	2.78 mm	Closed Frame	Tin	200 µin	5.08 µm	40	20	2	5.08 µm	200 µin	Through Hole	15.24 mm	DIP ZIF (ZIP)	0.6 "	1 A	UL94 V-0	Beryllium Copper