CONN SOCKET PGA ZIF GOLD
| Part | Pitch - Post | Pitch - Post | Mounting Type | Termination | Operating Temperature [Max] | Operating Temperature [Min] | Contact Finish - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination Post Length | Termination Post Length | Contact Finish - Mating | Features | Material Flammability Rating | Current Rating (Amps) | Type | Pitch - Mating | Pitch - Mating | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 2.54 mm | 0.1 in | Through Hole | Solder | 125 °C | -65 ░C | Tin | 200 µin | 5.08 µm | Beryllium Copper | 30 Áin | 0.76 Ám | 3.18 mm | 0.125 in | Gold | Closed Frame | UL94 V-0 | 1 A | PGA ZIF (ZIP) | 0.1 in | 2.54 mm | Beryllium Copper |
Aries Electronics | 2.54 mm | 0.1 in | Through Hole | Solder | 125 °C | -65 ░C | Tin | 200 µin | 5.08 µm | Beryllium Copper | 30 Áin | 0.76 Ám | 3.18 mm | 0.125 in | Gold | Closed Frame | UL94 V-0 | 1 A | PGA ZIF (ZIP) | 0.1 in | 2.54 mm | Beryllium Copper |
Aries Electronics | 2.54 mm | 0.1 in | Through Hole | Solder | 125 °C | -65 ░C | Tin | 200 µin | 5.08 µm | Beryllium Copper | 30 Áin | 0.76 Ám | 3.18 mm | 0.125 in | Gold | Closed Frame | UL94 V-0 | 1 A | PGA ZIF (ZIP) | 0.1 in | 2.54 mm | Beryllium Copper |