XCV200 Series
Manufacturer: AMD / Xilinx
IC FPGA 166 I/O 240QFP
| Part | Number of Logic Elements/Cells | Operating Temperature (Max) | Operating Temperature (Min) | Package Width | Package Name | Package Length | Mounting Type | Number of I/O | Number of Gates | Package / Case | Number of LABs/CLBs | Total RAM Bits | Voltage - Supply (Maximum) | Voltage - Supply (Minimum) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
AMD / Xilinx | 5292 | 85 °C | 0 °C | 32 mm | 240-PQFP | 32 mm | Surface Mount | 166 | 236666 | 240-BFQFP | 1176 | 57344 bits | 2.625 V | 2.375 V |
AMD / Xilinx | 5292 | 85 °C | 0 °C | 17 mm | 256-FBGA | 17 mm | Surface Mount | 176 | 236666 | 256-BGA | 1176 | 57344 bits | 2.625 V | 2.375 V |
AMD / Xilinx | 5292 | 100 °C | -40 °C | 32 mm | 240-PQFP | 32 mm | Surface Mount | 166 | 236666 | 240-BFQFP | 1176 | 57344 bits | 2.625 V | 2.375 V |
AMD / Xilinx | 5292 | 100 °C | -40 °C | 17 mm | 256-FBGA | 17 mm | Surface Mount | 176 | 236666 | 256-BGA | 1176 | 57344 bits | 2.625 V | 2.375 V |
AMD / Xilinx | 5292 | 85 °C | 0 °C | 27 mm | 256-PBGA | 27 mm | Surface Mount | 180 | 236666 | 256-BBGA | 1176 | 57344 bits | 2.625 V | 2.375 V |
AMD / Xilinx | 5292 | 85 °C | 0 °C | 32 mm | 240-PQFP | 32 mm | Surface Mount | 166 | 236666 | 240-BFQFP | 1176 | 57344 bits | 2.625 V | 2.375 V |
AMD / Xilinx | 5292 | 85 °C | 0 °C | 35 mm | 352-MBGA | 35 mm | Surface Mount | 260 | 236666 | 352-LBGA Exposed Pad Metal | 1176 | 57344 bits | 2.625 V | 2.375 V |
AMD / Xilinx | 5292 | 85 °C | 0 °C | 23 mm | 456-FBGA | 23 mm | Surface Mount | 284 | 236666 | 456-BBGA | 1176 | 57344 bits | 2.625 V | 2.375 V |
AMD / Xilinx | 5292 | 85 °C | 0 °C | 35 mm | 352-MBGA | 35 mm | Surface Mount | 260 | 236666 | 352-LBGA Exposed Pad Metal | 1176 | 57344 bits | 2.625 V | 2.375 V |
AMD / Xilinx | 5292 | 85 °C | 0 °C | 23 mm | 456-FBGA | 23 mm | Surface Mount | 284 | 236666 | 456-BBGA | 1176 | 57344 bits | 2.625 V | 2.375 V |