240 Series

Catalog

IC & COMPONENT SOCKET, 40 CONTACTS, DIP SOCKET, 2.54 MM, 240 SERIES, 15.24 MM, BERYLLIUM COPPER

Part	Pitch - Mating	Features	Termination	Row Spacing	Type	Contact Finish - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Operating Temperature (Max)	Operating Temperature (Min)	Pitch - Post	Contact Finish - Mating	Mounting Type	Housing Material	Contact Material - Post	Grid Columns	Number of Positions or Pins (Grid)	Grid Rows	Contact Material - Mating	Contact Resistance	Current Rating	Material Flammability Rating	Termination Post Length	Number of Pins	Convert To (Adapter End) Size	Convert To (Adapter End) Type	Convert From (Adapter End)	Convert From (Adapter End) Type	Convert From (Adapter End) Row Spacing
3M Electronic Specialty 240-1280-00-0602J	0.1 in	Closed Frame	Press-Fit	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Gold	30 µin	30 µin	125 °C	-55 °C	0.1 in	Gold	Connector	Glass Filled Polysulfone PSU	Beryllium Copper	20	40	2	Beryllium Copper	15 mOhm	1 A	UL94 V-0	0.11 in
3M Electronic Specialty 240-1280-19-0602J	0.1 in	Closed Frame	Wire Wrap			Gold	30 µin	30 µin	125 °C	-55 °C	0.1 in	Gold	Through Hole	Glass Filled Polysulfone PSU	Beryllium Copper				Beryllium Copper		1 A	UL94 V-0	0.62 in	40 pins	0.6 in	DIP Row Spacing	DIP	DIP Row Spacing	0.6 "
3M Electronic Specialty 240-5205-01		Closed Frame	Solder		QFN	Gold						Gold	Through Hole	PES Polyethersulfone	Beryllium Copper	10	40	4	Beryllium Copper	25 mOhm			0.118 in
3M Electronic Specialty 240-1280-29-0602J	0.1 in	Closed Frame	Solder			Gold	30 µin	30 µin	125 °C	-55 °C	0.1 in	Gold	Through Hole	Glass Filled Polysulfone PSU	Beryllium Copper				Beryllium Copper		1 A	UL94 V-0	0.13 in	40 pins	0.6 in	DIP Row Spacing	DIP	DIP Row Spacing	0.6 "
3M Electronic Specialty 240-3639-19-0602J	0.1 in	Closed Frame	Wire Wrap			Gold	30 µin	30 µin	125 °C	-55 °C	0.1 in	Gold	Through Hole	Glass Filled Polysulfone PSU	Beryllium Copper				Beryllium Copper		1 A	UL94 V-0	0.62 in	40 pins	1 in	DIP Row Spacing	DIP	DIP Row Spacing	1 in
3M Electronic Specialty 240-5205-00		Closed Frame	Solder		QFN	Gold						Gold	Through Hole	PES Polyethersulfone	Beryllium Copper	10	40	4	Beryllium Copper	25 mOhm			0.118 in
3M Electronic Specialty 240-3639-09-0602J	0.1 in	Closed Frame	Solder			Gold	30 µin	30 µin	125 °C	-55 °C	0.1 in	Gold	Through Hole	Glass Filled Polysulfone PSU	Beryllium Copper				Beryllium Copper		1 A	UL94 V-0	0.13 in	40 pins	1 in	DIP Row Spacing	DIP	DIP Row Spacing	1 in
3M Electronic Specialty 240-1280-09-0602J	0.1 in		Solder			Gold	30 µin	30 µin	125 °C	-55 °C	0.1 in	Gold	Through Hole	Glass Filled Polysulfone PSU	Beryllium Copper				Beryllium Copper		1 A	UL94 V-0	0.13 in	40 pins	0.6 in	DIP Row Spacing	DIP	DIP Row Spacing	0.6 "