26-0518 Series

Catalog

CONN SOCKET SIP 26POS GOLD

Part	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Contact Material - Post [custom]	Termination	Type	Material Flammability Rating	Features	Contact Finish - Mating	Housing Material	Contact Finish - Post	Mounting Type	Current Rating (Amps)	Pitch - Post	Pitch - Post	Termination Post Length	Termination Post Length	Number of Positions or Pins (Grid)	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Termination Post Length [x]	Termination Post Length [x]
Aries Electronics 26-0518-11	0.1 in	2.54 mm	10 çin	0.25 çm	Beryllium Copper	Brass	Solder	SIP	UL94 V-0	Open Frame	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	Gold	Through Hole	3 A	2.54 mm	0.1 in	3.18 mm	0.125 in	26	10 çin	0.25 çm
Aries Electronics 26-0518-10T	0.1 in	2.54 mm	10 çin	0.25 çm	Beryllium Copper	Brass	Solder	SIP	UL94 V-0	Open Frame	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	Tin	Through Hole	3 A	2.54 mm	0.1 in	3.18 mm	0.125 in	26	200 µin	5.08 µm
Aries Electronics 26-0518-10H	0.1 in	2.54 mm	10 çin	0.25 çm	Beryllium Copper	Brass	Solder	SIP	UL94 V-0	Open Frame	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	Tin	Through Hole	3 A	2.54 mm	0.1 in	3.18 mm	0.125 in	26	200 µin	5.08 µm
Aries Electronics 26-0518-00	0.1 in	2.54 mm	10 çin	0.25 çm	Beryllium Copper	Brass	Solder	SIP	UL94 V-0	Open Frame	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	Tin	Surface Mount	3 A	2.54 mm	0.1 in			26	200 µin	5.08 µm	0.046 in	1.17 mm
Aries Electronics 26-0518-10	0.1 in	2.54 mm	10 çin	0.25 çm	Beryllium Copper	Brass	Solder	SIP	UL94 V-0	Open Frame	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	Tin	Through Hole	3 A	2.54 mm	0.1 in	3.18 mm	0.125 in	26	200 µin	5.08 µm