18-823 Series
Manufacturer: Aries Electronics
CONN IC DIP SOCKET 18POS GOLD
| Part | Termination Post Length | Current Rating | Material Flammability Rating | Contact Material - Mating | Pitch - Post | Termination | Pitch - Mating | Contact Finish Thickness - Post | Operating Temperature (Min) | Operating Temperature (Max) | Row Spacing | Type | Contact Material - Post | Grid Columns | Grid Rows | Number of Positions or Pins (Grid) | Housing Material | Contact Finish Thickness - Mating | Mounting Type | Features | Contact Finish - Mating | Contact Finish - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 0.145 in | 1.5 A | UL94 V-0 | Phosphor Bronze | 0.1 in | Solder | 0.1 in | 10 µin | -55 °C | 105 °C | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | Phosphor Bronze | 9 | 2 | 18 | Nylon 4/6 PA46 Polyamide | 10 µin | Horizontal Right Angle Through Hole | Closed Frame | Gold | Gold |
Aries Electronics | 0.145 in | 1.5 A | UL94 V-0 | Phosphor Bronze | 0.1 in | Solder | 0.1 in | 200 µin | -55 °C | 105 °C | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | Phosphor Bronze | 9 | 2 | 18 | Nylon 4/6 PA46 Polyamide | 200 Ąin | Horizontal Right Angle Through Hole | Closed Frame | Tin | Tin |
Aries Electronics | 0.14 in | 3 A | UL94 V-0 | Beryllium Copper | 0.1 in | Solder | 0.1 in | 200 µin | -55 °C | 105 °C | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | Brass | 9 | 2 | 18 | Glass Filled Nylon 4/6 PA46 Polyamide | 30 µin | Horizontal Right Angle Through Hole | Closed Frame | Gold | Tin |