18-823 Series

Catalog

CONN IC DIP SOCKET 18POS GOLD

Part	Contact Material - Mating	Termination Post Length	Termination Post Length	Type	Type	Type	Contact Finish - Post	Housing Material	Current Rating (Amps)	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination	Operating Temperature [Max]	Operating Temperature [Min]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Number of Positions or Pins (Grid)	Material Flammability Rating	Pitch - Post	Pitch - Post	Contact Material - Post	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Features	Contact Material - Post [custom]
Aries Electronics 18-823-90	Phosphor Bronze	0.145 "	3.68 mm	0.3 "	7.62 mm	DIP	Gold	Polyamide (PA46) Nylon 4/6	1.5 A	10 çin	0.25 çm	Solder	105 ░C	-55 °C	10 çin	0.25 çm	18	UL94 V-0	2.54 mm	0.1 in	Phosphor Bronze	0.1 in	2.54 mm	Gold	Closed Frame
Aries Electronics 18-823-90T	Phosphor Bronze	0.145 "	3.68 mm	0.3 "	7.62 mm	DIP	Tin	Polyamide (PA46) Nylon 4/6	1.5 A	200 µin	5.08 µm	Solder	105 ░C	-55 °C	200 µin	5.08 µm	18	UL94 V-0	2.54 mm	0.1 in	Phosphor Bronze	0.1 in	2.54 mm		Closed Frame
Aries Electronics 18-823-90C	Beryllium Copper	0.14 in	3.56 mm	0.3 "	7.62 mm	DIP	Tin	Glass Filled Nylon 4/6 Polyamide (PA46)	3 A	30 Áin	0.76 Ám	Solder	105 ░C	-55 °C	200 µin	5.08 µm	18	UL94 V-0	2.54 mm	0.1 in		0.1 in	2.54 mm	Gold	Closed Frame	Brass