20-820 Series

Catalog

CONN IC DIP SOCKET 20POS GOLD

Part	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Post	Features	Material Flammability Rating	Contact Material - Post [custom]	Contact Finish - Mating	Number of Positions or Pins (Grid)	Termination Post Length	Termination Post Length	Current Rating (Amps)	Operating Temperature [Max]	Operating Temperature [Min]	Contact Material - Mating	Termination	Type	Type	Type	Pitch - Mating	Pitch - Mating	Housing Material	Pitch - Post	Pitch - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Post
Aries Electronics 20-820-90C	200 µin	5.08 µm	Tin	Closed Frame	UL94 V-0	Brass	Gold	20	3.56 mm	0.14 in	3 A	105 ░C	-55 °C	Beryllium Copper	Solder	0.3 "	7.62 mm	DIP	0.1 in	2.54 mm	Glass Filled Nylon 4/6 Polyamide (PA46)	2.54 mm	0.1 in	30 Áin	0.76 Ám
Aries Electronics 20-820-90T	200 µin	5.08 µm	Tin	Closed Frame	UL94 V-0			20	3.68 mm	0.145 "	1.5 A	105 ░C	-55 °C	Phosphor Bronze	Solder	0.3 "	7.62 mm	DIP	0.1 in	2.54 mm	Polyamide (PA46) Nylon 4/6	2.54 mm	0.1 in	200 µin	5.08 µm	Phosphor Bronze
Aries Electronics 20-820-90TWR	200 µin	5.08 µm	Tin	Closed Frame	UL94 V-0			20	3.68 mm	0.145 "	1.5 A	105 ░C	-55 °C	Phosphor Bronze	Solder	0.3 "	7.62 mm	DIP	0.1 in	2.54 mm	Polyamide (PA46) Nylon 4/6	2.54 mm	0.1 in	200 µin	5.08 µm	Phosphor Bronze
Aries Electronics 20-820-90	10 çin	0.25 çm	Gold	Closed Frame	UL94 V-0		Gold	20	3.68 mm	0.145 "	1.5 A	105 ░C	-55 °C	Phosphor Bronze	Solder	0.3 "	7.62 mm	DIP	0.1 in	2.54 mm	Polyamide (PA46) Nylon 4/6	2.54 mm	0.1 in	10 çin	0.25 çm	Phosphor Bronze