20-820 Series

Catalog

CONN IC DIP SOCKET 20POS GOLD

Part	Contact Finish Thickness - Mating	Contact Material - Post	Mounting Type	Housing Material	Pitch - Mating	Pitch - Post	Contact Finish Thickness - Post	Grid Rows	Grid Columns	Number of Positions or Pins (Grid)	Contact Finish - Mating	Operating Temperature (Min)	Operating Temperature (Max)	Row Spacing	Type	Contact Material - Mating	Termination	Contact Finish - Post	Features	Termination Post Length	Current Rating	Material Flammability Rating
Aries Electronics 20-820-90C	30 µin	Brass	Horizontal Right Angle Through Hole	Glass Filled Nylon 4/6 PA46 Polyamide	0.1 in	0.1 in	200 µin	2	10	20	Gold	-55 °C	105 °C	0.3 in	0.3" (7.62mm) Row Spacing DIP	Beryllium Copper	Solder	Tin	Closed Frame	0.14 in	3 A	UL94 V-0
Aries Electronics 20-820-90T	200 Ąin	Phosphor Bronze	Horizontal Right Angle Through Hole	Nylon 4/6 PA46 Polyamide	0.1 in	0.1 in	200 µin	2	10	20	Tin	-55 °C	105 °C	0.3 in	0.3" (7.62mm) Row Spacing DIP	Phosphor Bronze	Solder	Tin	Closed Frame	0.145 in	1.5 A	UL94 V-0
Aries Electronics 20-820-90TWR	200 Ąin	Phosphor Bronze	Horizontal Right Angle Through Hole	Nylon 4/6 PA46 Polyamide	0.1 in	0.1 in	200 µin	2	10	20	Tin	-55 °C	105 °C	0.3 in	0.3" (7.62mm) Row Spacing DIP	Phosphor Bronze	Solder	Tin	Closed Frame	0.145 in	1.5 A	UL94 V-0
Aries Electronics 20-820-90	10 µin	Phosphor Bronze	Horizontal Right Angle Through Hole	Nylon 4/6 PA46 Polyamide	0.1 in	0.1 in	10 µin	2	10	20	Gold	-55 °C	105 °C	0.3 in	0.3" (7.62mm) Row Spacing DIP	Phosphor Bronze	Solder	Gold	Closed Frame	0.145 in	1.5 A	UL94 V-0