CONN SOCKET 30POS 0.1 GOLD PCB
| Part | Contact Length - Post | Contact Length - Post | Insulation Color | Connector Type | Insulation Material | Number of Positions Loaded | Contact Shape | Number of Positions | Insulation Height [z] | Insulation Height [z] | Pitch - Mating | Pitch - Mating | Contact Material | Fastening Type | Contact Finish - Post | Row Spacing - Mating [x] | Row Spacing - Mating [x] | Operating Temperature [Min] | Operating Temperature [Max] | Contact Type | Termination | Mounting Type | Contact Finish - Mating | Material Flammability Rating | Number of Rows | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Insulation Height | Insulation Height | Contact Length - Post [x] | Contact Length - Post [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 0.215 in | 5.46 mm | Black | Elevated Socket | Liquid Crystal Polymer (LCP) | All | Circular | 30 | 0.3 in | 7.62 mm | 0.1 in | 2.54 mm | Beryllium Copper | Push-Pull | Tin | 2.54 mm | 0.1 in | -55 °C | 125 °C | Female Socket | Solder | Through Hole | Gold | UL94 V-0 | 2 | 10 çin | 0.25 çm | ||||||
Samtec Inc. | 0.115 in | 2.92 mm | Black | Elevated Socket | Liquid Crystal Polymer (LCP) | All | Circular | 30 | 0.1 in | 2.54 mm | Beryllium Copper | Push-Pull | Gold | 2.54 mm | 0.1 in | -55 °C | 125 °C | Female Socket | Solder | Through Hole | Gold | UL94 V-0 | 2 | 10 çin | 0.25 çm | 10 çin | 0.25 çm | 0.4 in | 10.16 mm | ||||
Samtec Inc. | Black | Elevated Socket | Liquid Crystal Polymer (LCP) | All | Circular | 30 | 0.1 in | 2.54 mm | Beryllium Copper | Push-Pull | Gold | 2.54 mm | 0.1 in | -55 °C | 125 °C | Female Socket | Solder | Through Hole | Gold | UL94 V-0 | 2 | 10 çin | 0.25 çm | 10 çin | 0.25 çm | 0.5 in | 12.7 mm | 0.165 in | 4.19 mm | ||||
Samtec Inc. | 0.365 in | 9.27 mm | Black | Elevated Socket | Liquid Crystal Polymer (LCP) | All | Circular | 30 | 0.3 in | 7.62 mm | 0.1 in | 2.54 mm | Beryllium Copper | Push-Pull | Tin | 2.54 mm | 0.1 in | -55 °C | 125 °C | Female Socket | Solder | Through Hole | Gold | UL94 V-0 | 2 | 10 çin | 0.25 çm | ||||||
Samtec Inc. | Black | Elevated Socket | Liquid Crystal Polymer (LCP) | All | Circular | 30 | 0.1 in | 2.54 mm | Beryllium Copper | Push-Pull | Tin | 2.54 mm | 0.1 in | -55 °C | 125 °C | Female Socket | Solder | Through Hole | Gold | UL94 V-0 | 2 | 10 çin | 0.25 çm | 0.5 in | 12.7 mm | 0.165 in | 4.19 mm | ||||||
Samtec Inc. | 0.153 in | 3.89 mm | Black | Elevated Socket | Liquid Crystal Polymer (LCP) | All | Circular | 30 | 0.3 in | 7.62 mm | 0.1 in | 2.54 mm | Beryllium Copper | Push-Pull | Gold | 2.54 mm | 0.1 in | -55 °C | 125 °C | Female Socket | Solder | Through Hole | Gold | UL94 V-0 | 2 | 10 çin | 0.25 çm | 10 çin | 0.25 çm | ||||
Samtec Inc. | 0.153 in | 3.89 mm | Black | Elevated Socket | Liquid Crystal Polymer (LCP) | All | Circular | 30 | 0.3 in | 7.62 mm | 0.1 in | 2.54 mm | Beryllium Copper | Push-Pull | Tin | 2.54 mm | 0.1 in | -55 °C | 125 °C | Female Socket | Solder | Through Hole | UL94 V-0 | 2 |