ESS-119 Series

Catalog

CONN SOCKET 19POS 0.1 GOLD PCB

Part	Pitch - Mating	Mounting Type	Fastening Type	Contact Finish Thickness - Mating	Insulation Height	Contact Length - Post	Contact Finish - Mating	Style	Material Flammability Rating	Contact Type	Number of Rows	Number of Positions Loaded	Number of Positions	Insulation Color	Contact Finish - Post	Connector Type	Operating Temperature (Max)	Operating Temperature (Min)	Termination	Contact Shape	Contact Material	Insulation Material	Contact Finish Thickness - Post
Samtec Inc. ESS-119-T-04	0.1 in	Through Hole	Push-Pull	10 µin	0.4 in	0.123 in	Gold	Board	UL94 V-0	Female Socket	1	All	19	Black	Tin	Elevated Socket	125 °C	-55 °C	Solder	Circular	Beryllium Copper	Liquid Crystal Polymer (LCP)
Samtec Inc. ESS-119-T-25	0.1 in	Through Hole	Push-Pull	10 µin	0.5 in	0.173 in	Gold	Board	UL94 V-0	Female Socket	1	All	19	Black	Tin	Elevated Socket	125 °C	-55 °C	Solder	Circular	Beryllium Copper	Liquid Crystal Polymer (LCP)
Samtec Inc. ESS-119-T-23	0.1 in	Through Hole	Push-Pull	10 µin	0.3 in	0.115 in	Gold	Board	UL94 V-0	Female Socket	1	All	19	Black	Tin	Elevated Socket	125 °C	-55 °C	Solder	Circular	Beryllium Copper	Liquid Crystal Polymer (LCP)
Samtec Inc. ESS-119-G-05	0.1 in	Through Hole	Push-Pull	10 µin	0.5 in	0.173 in	Gold	Board	UL94 V-0	Female Socket	1	All	19	Black	Gold	Elevated Socket	125 °C	-55 °C	Solder	Circular	Beryllium Copper	Liquid Crystal Polymer (LCP)	10 µin
Samtec Inc. ESS-119-TT-04	0.1 in	Through Hole	Push-Pull		0.4 in	0.123 in	Tin	Board	UL94 V-0	Female Socket	1	All	19	Black	Tin	Elevated Socket	125 °C	-55 °C	Solder	Circular	Beryllium Copper	Liquid Crystal Polymer (LCP)
Samtec Inc. ESS-119-T-03	0.1 in	Through Hole	Push-Pull	10 µin	0.3 in	0.123 in	Gold	Board	UL94 V-0	Female Socket	1	All	19	Black	Tin	Elevated Socket	125 °C	-55 °C	Solder	Circular	Beryllium Copper	Liquid Crystal Polymer (LCP)