18-3513 Series

Catalog

CONN IC DIP SOCKET 18POS GOLD

Part	Material Flammability Rating	Termination Post Length	Current Rating	Mounting Type	Grid Columns	Grid Rows	Number of Positions or Pins (Grid)	Contact Finish - Mating	Pitch - Post	Contact Material - Post	Contact Finish Thickness - Post	Termination	Contact Finish - Post	Contact Material - Mating	Row Spacing	Type	Housing Material	Operating Temperature (Min)	Operating Temperature (Max)	Features	Contact Finish Thickness - Mating	Pitch - Mating
Aries Electronics 18-3513-10H	UL94 V-0	0.125 in	3 A	Through Hole	9	2	18	Gold	0.1 in	Brass	200 µin	Solder	Tin	Beryllium Copper	0.3 in	0.3" (7.62mm) Row Spacing DIP	Glass Filled Nylon 4/6 PA46 Polyamide	-55 °C	105 °C	Closed Frame	10 µin	0.1 in
Aries Electronics 18-3513-10T	UL94 V-0	0.125 in	3 A	Through Hole	9	2	18	Gold	0.1 in	Brass	200 µin	Solder	Tin	Beryllium Copper	0.3 in	0.3" (7.62mm) Row Spacing DIP	Glass Filled Nylon 4/6 PA46 Polyamide	-55 °C	105 °C	Closed Frame	10 µin	0.1 in
Aries Electronics 18-3513-00	UL94 V-0	0.125 in	3 A	Through Hole	9	2	18	Gold	0.1 in	Brass	200 µin	Solder	Tin	Beryllium Copper	0.3 in	0.3" (7.62mm) Row Spacing DIP	Glass Filled Nylon 4/6 PA46 Polyamide	-55 °C	105 °C	Closed Frame	10 µin	0.1 in
Aries Electronics 18-3513-10	UL94 V-0	0.125 in	3 A	Through Hole	9	2	18	Gold	0.1 in	Brass	200 µin	Solder	Tin	Beryllium Copper	0.3 in	0.3" (7.62mm) Row Spacing DIP	Glass Filled Nylon 4/6 PA46 Polyamide	-55 °C	105 °C	Closed Frame	10 µin	0.1 in