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CONN IC DIP SOCKET ZIF 28POS
| Part | Operating Temperature [Min] | Operating Temperature [Max] | Material Flammability Rating | Type | Type | Type | Number of Positions or Pins (Grid) | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Termination Post Length | Termination Post Length | Contact Finish - Mating | Pitch - Mating | Pitch - Mating | Pitch - Post | Pitch - Post | Current Rating (Amps) | Mounting Type | Housing Material | Contact Material - Post | Features | Termination | Contact Finish - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Material - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | -55 °C | 250 °C | UL94 V-0 | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | 28 | 1.27 µm | 50 µin | 0.11 in | 2.78 mm | Nickel Boron | 0.1 in | 2.54 mm | 2.54 mm | 0.1 in | 1 A | Through Hole | Polyetheretherketone (PEEK) Glass Filled | Beryllium Nickel | Closed Frame | Solder | Nickel Boron | 1.27 µm | 50 µin | Beryllium Nickel |
Aries Electronics | UL94 V-0 | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | 28 | 1.27 µm | 50 µin | 0.11 in | 2.78 mm | Nickel Boron | 0.1 in | 2.54 mm | 2.54 mm | 0.1 in | 1 A | Through Hole | Polyphenylene Sulfide (PPS) Glass Filled | Beryllium Copper | Closed Frame | Solder | Nickel Boron | 1.27 µm | 50 µin | Beryllium Copper |