CONN IC DIP SOCKET 36POS GOLD
| Part | Termination Post Length | Termination Post Length | Housing Material | Number of Positions or Pins (Grid) | Type | Type | Type | Current Rating (Amps) | Termination | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Material Flammability Rating | Mounting Type | Contact Finish - Mating | Contact Finish - Post | Features | Pitch - Post | Pitch - Post | Contact Material - Post [custom] | Contact Material - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 3.3 mm | 0.13 in | Polyphenylene Sulfide (PPS) Glass Filled | 36 | DIP | 0.6 in | 15.24 mm | 3 A | Solder | 0.1 in | 2.54 mm | 30 Áin | 0.76 Ám | UL94 V-0 | Through Hole | Gold | Gold | Open Frame | 2.54 mm | 0.1 in | Brass | Beryllium Copper | 10 çin | 0.25 çm |
Aries Electronics | 10.74 mm | 0.423 in | Polyphenylene Sulfide (PPS) Glass Filled | 36 | DIP | 0.6 in | 15.24 mm | 3 A | Wire Wrap | 0.1 in | 2.54 mm | 30 Áin | 0.76 Ám | UL94 V-0 | Through Hole | Gold | Gold | Open Frame | 2.54 mm | 0.1 in | Brass | Beryllium Copper | 10 çin | 0.25 çm |
Aries Electronics | 4.57 mm | 0.18 in | Polyphenylene Sulfide (PPS) Glass Filled | 36 | DIP | 0.6 in | 15.24 mm | 3 A | 0.1 in | 2.54 mm | 30 Áin | 0.76 Ám | UL94 V-0 | Through Hole | Gold | Tin | Open Frame | 2.54 mm | 0.1 in | Brass | Beryllium Copper | 200 µin | 5.08 µm | |
Aries Electronics | 4.57 mm | 0.18 in | Polyphenylene Sulfide (PPS) Glass Filled | 36 | DIP | 0.6 in | 15.24 mm | 3 A | 0.1 in | 2.54 mm | 30 Áin | 0.76 Ám | UL94 V-0 | Through Hole | Gold | Gold | Open Frame | 2.54 mm | 0.1 in | Brass | Beryllium Copper | 10 çin | 0.25 çm | |
Aries Electronics | 10.74 mm | 0.423 in | Polyphenylene Sulfide (PPS) Glass Filled | 36 | DIP | 0.6 in | 15.24 mm | 3 A | Wire Wrap | 0.1 in | 2.54 mm | 30 Áin | 0.76 Ám | UL94 V-0 | Through Hole | Gold | Tin | Open Frame | 2.54 mm | 0.1 in | Brass | Beryllium Copper | 200 µin | 5.08 µm |
Aries Electronics | 3.3 mm | 0.13 in | Polyphenylene Sulfide (PPS) Glass Filled | 36 | DIP | 0.6 in | 15.24 mm | 3 A | Solder | 0.1 in | 2.54 mm | 30 Áin | 0.76 Ám | UL94 V-0 | Through Hole | Gold | Tin | Open Frame | 2.54 mm | 0.1 in | Brass | Beryllium Copper | 200 µin | 5.08 µm |
Aries Electronics | 7.19 mm | 0.283 in | Polyphenylene Sulfide (PPS) Glass Filled | 36 | DIP | 0.6 in | 15.24 mm | 3 A | Wire Wrap | 0.1 in | 2.54 mm | 30 Áin | 0.76 Ám | UL94 V-0 | Through Hole | Gold | Tin | Open Frame | 2.54 mm | 0.1 in | Brass | Beryllium Copper | 200 µin | 5.08 µm |