44-6553 Series

Catalog

CONN IC DIP SOCKET ZIF 44POS

Part	Material Flammability Rating	Termination Post Length	Current Rating	Row Spacing	Type	Termination	Contact Material - Mating	Mounting Type	Pitch - Post	Contact Finish - Mating	Housing Material	Number of Positions or Pins (Grid)	Grid Rows	Grid Columns	Contact Material - Post	Contact Finish - Post	Operating Temperature (Max)	Operating Temperature (Min)	Features	Contact Finish Thickness - Mating	Pitch - Mating	Contact Finish Thickness - Post
Aries Electronics 44-6553-18	UL94 V-0	0.11 in	1 A	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Solder	Beryllium Nickel	Through Hole	0.1 in	Boron Nickel	Glass Filled PEEK Polyetheretherketone	44	2	22	Beryllium Nickel	Nickel Boron	250 °C	-55 °C	Closed Frame	50 µin	0.1 in	50 µin
Aries Electronics 44-6553-16	UL94 V-0	0.11 in	1 A	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Solder	Beryllium Copper	Through Hole	0.1 in	Boron Nickel	Glass Filled Polyphenylene Sulfide PPS	44	2	22	Beryllium Copper	Nickel Boron			Closed Frame	50 µin	0.1 in	50 µin
Aries Electronics 44-6553-10	UL94 V-0	0.11 in	1 A	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Solder	Beryllium Copper	Through Hole	0.1 in	Tin	Glass Filled Polyphenylene Sulfide PPS	44	2	22	Beryllium Copper	Tin			Closed Frame	200 Ąin	0.1 in	200 µin
Aries Electronics 44-6553-11	UL94 V-0	0.11 in	1 A	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Solder	Beryllium Copper	Through Hole	0.1 in	Gold	Glass Filled Polyphenylene Sulfide PPS	44	2	22	Beryllium Copper	Gold			Closed Frame		0.1 in