MC33FS6522 Series
Manufacturer: NXP USA Inc.
SYSTEM BASIS CHIP, DCDC 2.2A VCORE LDT, LQFP48EP/ REEL ROHS COMPLIANT: YES
| Part | Package / Case | Voltage - Supply (Minimum) | Voltage - Supply (Maximum) | Operating Temperature (Max) | Operating Temperature (Min) | Applications | Mounting Type | Package Length | Package Name | Package Width |
|---|---|---|---|---|---|---|---|---|---|---|
NXP USA Inc. | 48-LQFP Exposed Pad | 1 V | 5 V | 125 °C | -40 °C | System Basis Chip | Surface Mount | 7 mm | 48-HLQFP | 7 mm |
NXP USA Inc. | 48-LQFP Exposed Pad | 1 V | 5 V | 125 °C | -40 °C | System Basis Chip | Surface Mount | 7 mm | 48-HLQFP | 7 mm |
NXP USA Inc. | 48-LQFP Exposed Pad | 1 V | 5 V | 125 °C | -40 °C | System Basis Chip | Surface Mount | 7 mm | 48-HLQFP | 7 mm |
NXP USA Inc. | 48-LQFP Exposed Pad | 1 V | 5 V | 125 °C | -40 °C | System Basis Chip | Surface Mount | 7 mm | 48-HLQFP | 7 mm |